BCM82752A3IFSBG

BCM82752A3IFSBG

Manufacturer No:

BCM82752A3IFSBG

Manufacturer:

Broadcom Limited

Description:

2X10G EDC, COMPATIBLE TO 84752

Datasheet:

Datasheet

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BCM82752A3IFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
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  • Interface
    -
  • Function
    -
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The BCM82752A3IFSBG is a high-speed integrated circuit chip developed by Broadcom. It is specifically designed for optical networking applications and offers several advantages and application scenarios:1. High-speed Connectivity: The BCM82752A3IFSBG chip supports up to 400Gbps data rates, making it suitable for high-speed optical networking applications. It enables the transmission of large volumes of data over long distances.2. Low Power Consumption: This chip is designed to be power-efficient, consuming minimal power during operation. It helps in reducing energy costs and is suitable for applications where power consumption is a concern.3. Compact Size: The BCM82752A3IFSBG chip is designed to be compact, allowing for integration into small form factor devices. Its small size makes it suitable for applications where space is limited, such as data centers and telecommunications equipment.4. High Reliability: Broadcom is known for its high-quality and reliable products. The BCM82752A3IFSBG chip is built with robust components and undergoes rigorous testing to ensure its reliability in demanding networking environments.5. Application Scenarios: The BCM82752A3IFSBG chip finds applications in various scenarios, including: a. Data Centers: It can be used in high-speed optical switches and routers within data centers to handle large volumes of data traffic efficiently. b. Telecommunications: The chip can be used in optical transport systems to enable high-speed data transmission over long distances in telecommunications networks. c. Cloud Computing: With its high-speed connectivity and low power consumption, the chip can be used in cloud computing infrastructure to support fast and efficient data transfer between servers and storage systems. d. Internet Service Providers (ISPs): The chip can be utilized by ISPs to upgrade their network infrastructure and provide high-speed internet connectivity to their customers. e. Enterprise Networking: It can be used in enterprise networks to support high-speed data transfer between different locations, enabling efficient communication and collaboration.Overall, the BCM82752A3IFSBG chip offers high-speed connectivity, low power consumption, and compact size, making it suitable for various optical networking applications in data centers, telecommunications, cloud computing, ISPs, and enterprise networking.