SI3050-E1-FTR

SI3050-E1-FTR

Manufacturer No:

SI3050-E1-FTR

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SI3050-E1-FTR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    8.5mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    GCI, PCM, SPI
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The SI3050-E1-FTR integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low Power Consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. High Performance: The SI3050-E1-FTR chips offer high-performance capabilities, enabling them to handle complex tasks and data processing efficiently. 3. Small Form Factor: These chips are compact in size, making them suitable for applications where space is limited, such as in portable devices or IoT devices. 4. Wide Operating Range: The chips can operate over a wide range of voltages and temperatures, making them versatile and suitable for various environments. 5. Integrated Features: The SI3050-E1-FTR chips come with integrated features like analog-to-digital converters (ADCs), digital-to-analog converters (DACs), and communication interfaces, reducing the need for additional external components.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and small form factor of these chips make them ideal for IoT applications, such as smart home devices, wearable devices, and sensor networks. 2. Industrial Automation: The high-performance capabilities and wide operating range of these chips make them suitable for industrial automation applications, including control systems, monitoring devices, and robotics. 3. Medical Devices: The integrated features and low power consumption of these chips make them suitable for medical devices, such as patient monitoring systems, portable diagnostic devices, and implantable devices. 4. Consumer Electronics: The compact size and integrated features of these chips make them suitable for various consumer electronics applications, including smartphones, tablets, gaming consoles, and audio/video devices. 5. Automotive Electronics: The wide operating range and high-performance capabilities of these chips make them suitable for automotive electronics applications, such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).Overall, the SI3050-E1-FTR integrated circuit chips offer advantages like low power consumption, high performance, and small form factor, making them suitable for a wide range of applications in IoT, industrial automation, medical devices, consumer electronics, and automotive electronics.