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SI3050-E1-FMR

SI3050-E1-FMR

Manufacturer No:

SI3050-E1-FMR

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 24QFN

Datasheet:

Datasheet

Delivery:

Payment:

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SI3050-E1-FMR Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-QFN (4x4)
  • Package / Case
    24-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    8.5mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    GCI, PCM, SPI
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The SI3050-E1-FMR integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low Power Consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. High Performance: The SI3050-E1-FMR chips offer high-performance capabilities, enabling them to handle complex tasks and data processing efficiently. 3. Small Form Factor: These chips are compact in size, making them suitable for applications where space is limited, such as wearable devices, IoT devices, and small electronic gadgets. 4. Integrated Features: The chips come with integrated features like analog-to-digital converters (ADCs), digital-to-analog converters (DACs), and various communication interfaces, reducing the need for additional components and simplifying the overall design. 5. Wide Operating Range: The chips can operate over a wide range of voltages and temperatures, making them suitable for various environments and applications.Application Scenarios: 1. Internet of Things (IoT): The SI3050-E1-FMR chips can be used in IoT devices for wireless communication, sensor data processing, and connectivity with other devices or networks. 2. Wearable Devices: These chips can be used in wearable devices like smartwatches, fitness trackers, and healthcare monitoring devices, providing low-power wireless connectivity and data processing capabilities. 3. Industrial Automation: The chips can be used in industrial automation systems for data acquisition, control, and communication, enabling efficient and reliable operation. 4. Home Automation: These chips can be used in home automation systems for controlling and monitoring various devices and appliances, providing wireless connectivity and data processing capabilities. 5. Smart Grids: The chips can be used in smart grid systems for monitoring and controlling power distribution, enabling efficient energy management and grid optimization.Overall, the SI3050-E1-FMR integrated circuit chips offer low power consumption, high performance, and integrated features, making them suitable for a wide range of applications in IoT, wearable devices, industrial automation, home automation, and smart grids.
SI3050-E1-FMR Relevant information