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BA8206F-E2

BA8206F-E2

Manufacturer No:

BA8206F-E2

Manufacturer:

Description:

IC TELECOM INTERFACE 8SOP

Datasheet:

Datasheet

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BA8206F-E2 Specifications

  • Type
    Parameter
  • Power (Watts)
    450 mW
  • Supplier Device Package
    8-SOP
  • Package / Case
    8-SOIC (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -25°C ~ 75°C
  • Current - Supply
    -
  • Voltage - Supply
    38V
  • Number of Circuits
    1
  • Interface
    -
  • Function
    Tone Generator
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The BA8206F-E2 is an integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. Compact Size: The chip is small in size, making it suitable for portable devices and space-constrained applications.2. Low Power Consumption: It operates on low power, making it energy-efficient and suitable for battery-powered devices.3. High-Quality Audio: The chip provides high-quality audio output with low distortion and noise, ensuring a superior audio experience.4. Multiple Input Options: It supports various input options such as line-in, microphone, and stereo inputs, allowing flexibility in audio source selection.5. Built-in Amplification: The chip includes built-in amplification capabilities, eliminating the need for external amplifiers in many applications.6. Protection Features: It incorporates protection features like thermal shutdown, overcurrent protection, and short-circuit protection, ensuring the safety and longevity of the chip and connected devices.Application scenarios for the BA8206F-E2 chip include:1. Portable Audio Devices: It can be used in portable speakers, headphones, and earphones to provide high-quality audio output with minimal power consumption.2. Automotive Audio Systems: The chip can be integrated into car audio systems to enhance the audio quality and provide amplification for speakers.3. Home Audio Systems: It can be used in compact home audio systems, soundbars, and multimedia speakers to deliver high-fidelity audio.4. Communication Devices: The chip can be utilized in devices like intercom systems, conference phones, and voice recorders to process and amplify audio signals.5. Gaming Consoles: It can be integrated into gaming consoles and accessories to provide immersive audio experiences for gamers.6. Industrial Applications: The chip can be used in industrial equipment, public address systems, and audio amplifiers for various applications requiring audio processing and amplification.Overall, the BA8206F-E2 chip offers advantages such as compact size, low power consumption, high-quality audio, and protection features, making it suitable for a wide range of audio applications.
BA8206F-E2 Relevant information