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HC5513BIP

HC5513BIP

Manufacturer No:

HC5513BIP

Manufacturer:

Intersil

Description:

SLIC, 2-4 CONVERSION, PDIP22

Datasheet:

Datasheet

Delivery:

Payment:

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HC5513BIP Specifications

  • Type
    Parameter
  • Supplier Device Package
    22-PDIP
  • Package / Case
    22-DIP (0.400", 10.16mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C
  • Power (Watts)
    150 mW
  • Current - Supply
    5.5mA
  • Voltage - Supply
    ±4.75V ~ 5.25V
  • Number of Circuits
    1
  • Interface
    2-Wire, 4-Wire
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The HC5513BIP is a specific integrated circuit (IC) chip that belongs to the HC5513 family of chips. Unfortunately, there is limited information available about this specific chip, and it is not widely known or documented. As a result, it is challenging to provide specific advantages and application scenarios for the HC5513BIP chip.However, in general, IC chips like the HC5513BIP are designed for various applications in different industries. Some potential advantages and application scenarios of IC chips could include:1. Compact Size: IC chips are typically small in size, allowing for space-saving designs in electronic devices. 2. Low Power Consumption: Many IC chips are designed to operate efficiently with low power consumption, making them suitable for battery-powered devices. 3. Integration of Multiple Functions: IC chips often integrate multiple functions into a single chip, reducing the need for additional components and simplifying circuit designs. 4. High Performance: IC chips can offer high-speed operation, precision, and accuracy, making them suitable for applications that require fast processing or precise measurements. 5. Cost-Effectiveness: IC chips are mass-produced, leading to cost-effective solutions for various applications.Without specific information about the HC5513BIP chip, it is challenging to provide precise advantages and application scenarios. It is recommended to refer to the datasheet or technical documentation provided by the manufacturer for detailed information about the chip's features, advantages, and potential applications.
HC5513BIP Relevant information