HC4P5509A1R3060

HC4P5509A1R3060

Manufacturer No:

HC4P5509A1R3060

Manufacturer:

Intersil

Description:

SLIC, 2-4 CONVERSION, BIPOLAR,

Datasheet:

Datasheet

Delivery:

Payment:

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HC4P5509A1R3060 Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-PLCC (11.51x11.51)
  • Package / Case
    28-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 75°C
  • Power (Watts)
    200 mW
  • Current - Supply
    -
  • Voltage - Supply
    -42V ~ -58V, 4.75V ~ 5.25V
  • Number of Circuits
    1
  • Interface
    2-Wire, 4-Wire
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The HC4P5509A1R3060 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a clock frequency of up to 550 MHz, making them suitable for demanding applications. 2. Low Power Consumption: The chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Small Form Factor: The chips are available in a compact form factor, allowing for easy integration into various electronic devices and systems. 4. Rich Peripheral Set: They come with a rich set of peripherals, including UART, SPI, I2C, GPIO, timers, and more, providing flexibility for different application requirements. 5. Enhanced Security: The chips offer enhanced security features, such as hardware encryption and decryption, secure boot, and tamper detection, ensuring data protection and system integrity.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and small form factor of these chips make them suitable for IoT applications, such as smart home devices, wearables, and industrial sensors. 2. Embedded Systems: The high performance and rich peripheral set make these chips ideal for embedded systems, including industrial automation, robotics, and automotive applications. 3. Communication Systems: The chips can be used in communication systems, such as routers, gateways, and network switches, where high performance and security are essential. 4. Consumer Electronics: These chips can be utilized in various consumer electronics devices, including smart TVs, set-top boxes, gaming consoles, and audio systems, to provide high-performance processing and connectivity capabilities. 5. Medical Devices: The low power consumption and security features make these chips suitable for medical devices, such as patient monitoring systems, portable diagnostic devices, and medical implants.Overall, the HC4P5509A1R3060 integrated circuit chips offer high performance, low power consumption, and enhanced security, making them versatile for a wide range of applications in IoT, embedded systems, communication systems, consumer electronics, and medical devices.