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HC9P-5509B-9

HC9P-5509B-9

Manufacturer No:

HC9P-5509B-9

Manufacturer:

Harris Corporation

Description:

ITU CO/LOOP CARRIER SLIC

Datasheet:

Datasheet

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HC9P-5509B-9 Specifications

  • Type
    Parameter
  • Power (Watts)
    200 mW
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    -42V ~ -58V, 4.75V ~ 5.25V
  • Number of Circuits
    1
  • Interface
    2-Wire, 4-Wire
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The HC9P-5509B-9 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The HC9P-5509B-9 chips are designed to deliver high performance with a powerful processor and advanced features. 2. Low Power Consumption: These chips are optimized for low power consumption, making them suitable for battery-powered devices or energy-efficient applications. 3. Compact Size: The chips are designed to be compact, allowing for easy integration into small form factor devices or space-constrained applications. 4. Versatility: The HC9P-5509B-9 chips offer a wide range of functionalities, making them suitable for various applications across different industries. 5. Cost-Effective: These chips provide a cost-effective solution for applications that require high performance and advanced features.Application Scenarios: 1. Internet of Things (IoT): The HC9P-5509B-9 chips can be used in IoT devices such as smart home automation systems, wearable devices, or industrial IoT applications. 2. Embedded Systems: These chips are suitable for embedded systems like industrial control systems, robotics, or automotive applications. 3. Consumer Electronics: The chips can be used in various consumer electronics devices such as smartphones, tablets, or multimedia devices. 4. Medical Devices: The HC9P-5509B-9 chips can be utilized in medical devices like patient monitoring systems, diagnostic equipment, or medical imaging devices. 5. Communication Systems: These chips can be integrated into communication systems such as routers, switches, or network equipment to provide high-performance networking capabilities.Overall, the HC9P-5509B-9 integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in different industries.
HC9P-5509B-9 Relevant information