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SI3010-F-FS

SI3010-F-FS

Manufacturer No:

SI3010-F-FS

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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SI3010-F-FS Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    15mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    Parallel, SPI, UART
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The SI3010-F-FS integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: The SI3010-F-FS chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. Small form factor: These chips are available in a compact package, allowing for space-saving designs and integration into small devices. 3. High performance: The SI3010-F-FS chips offer high-speed data transmission and reliable signal integrity, making them suitable for applications that require fast and accurate communication. 4. Easy integration: These chips are designed to be easily integrated into existing systems, reducing development time and effort. 5. Cost-effective: The SI3010-F-FS chips provide a cost-effective solution for various applications, making them suitable for mass production and commercial use.Application scenarios: 1. Industrial automation: The SI3010-F-FS chips can be used in industrial automation systems for reliable and high-speed communication between different devices and sensors. 2. Internet of Things (IoT): These chips can be used in IoT devices for wireless communication and data transfer, enabling connectivity and interoperability between various IoT devices. 3. Consumer electronics: The SI3010-F-FS chips can be used in consumer electronics such as smartphones, tablets, and wearables for high-speed data transfer and wireless connectivity. 4. Automotive: These chips can be used in automotive applications for reliable and fast communication between different components and systems within a vehicle. 5. Medical devices: The SI3010-F-FS chips can be used in medical devices for wireless communication and data transfer, enabling remote monitoring and diagnostics. 6. Smart home automation: These chips can be used in smart home automation systems for wireless communication and control of various devices and appliances. 7. Telecommunications: The SI3010-F-FS chips can be used in telecommunications equipment for high-speed data transmission and reliable signal integrity.Overall, the SI3010-F-FS integrated circuit chips offer low power consumption, small form factor, high performance, easy integration, and cost-effectiveness, making them suitable for a wide range of applications in various industries.
SI3010-F-FS Relevant information