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HC3-5509B-9

HC3-5509B-9

Manufacturer No:

HC3-5509B-9

Manufacturer:

Harris Corporation

Description:

ITU CO/LOOP CARRIER SLIC

Datasheet:

Datasheet

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HC3-5509B-9 Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-PDIP
  • Package / Case
    28-DIP (0.600", 15.24mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C
  • Power (Watts)
    200 mW
  • Current - Supply
    -
  • Voltage - Supply
    -42V ~ -58V, 4.75V ~ 5.25V
  • Number of Circuits
    1
  • Interface
    2-Wire, 4-Wire
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The HC3-5509B-9 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The HC3-5509B-9 chips are designed to deliver high performance with a powerful processing capability, making them suitable for demanding applications. 2. Low Power Consumption: These chips are optimized for low power consumption, making them energy-efficient and suitable for battery-powered devices. 3. Compact Size: The HC3-5509B-9 chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Versatility: These chips offer versatile functionality, making them suitable for a wide range of applications. 5. Cost-Effective: The HC3-5509B-9 chips provide a cost-effective solution for various electronic designs, making them suitable for both consumer and industrial applications.Application Scenarios: 1. Internet of Things (IoT): The HC3-5509B-9 chips can be used in IoT devices for data processing, connectivity, and control functions. 2. Embedded Systems: These chips are suitable for embedded systems, such as industrial automation, robotics, and automotive applications, where high performance and low power consumption are crucial. 3. Consumer Electronics: The HC3-5509B-9 chips can be used in various consumer electronics devices, including smartphones, tablets, smart home devices, and wearable devices. 4. Communication Systems: These chips can be utilized in communication systems, such as routers, switches, and network equipment, for data processing and network management. 5. Medical Devices: The HC3-5509B-9 chips can be used in medical devices, such as patient monitoring systems, diagnostic equipment, and medical imaging devices, for data processing and analysis.Overall, the HC3-5509B-9 integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in different industries.
HC3-5509B-9 Relevant information