HC55171CB
Manufacturer No:
HC55171CB
Manufacturer:
Description:
5 REN RINGING SLIC FOR ISDN
Datasheet:
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In Stock : 10864
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HC55171CB Specifications
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TypeParameter
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Supplier Device Package28-SOIC
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Package / Case28-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 75°C
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Power (Watts)300 mW
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Current - Supply6mA
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Voltage - Supply-16V ~ -80V, 4.75V ~ 5.25V
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Number of Circuits1
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Interface2-Wire, 4-Wire
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FunctionSubscriber Line Interface Concept (SLIC)
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PackagingBulk
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Product StatusActive
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Series-
The HC55171CB is a specific integrated circuit (IC) chip that belongs to the HC5517x family of ICs. Unfortunately, there is limited information available about this specific chip, and it is not widely known or used. As a result, it is challenging to provide specific advantages and application scenarios for the HC55171CB.However, in general, IC chips like the HC5517x family are designed for various applications in the field of electronics. Some potential advantages and application scenarios of IC chips could include:1. Compact Size: IC chips are typically small in size, allowing for space-saving designs in electronic devices. 2. Integration: IC chips often integrate multiple functions or components into a single chip, reducing the need for additional external components. 3. Power Efficiency: IC chips are designed to be power-efficient, helping to extend battery life in portable devices. 4. Cost-Effectiveness: IC chips are mass-produced, leading to cost savings in manufacturing and assembly processes. 5. Versatility: IC chips can be used in a wide range of applications, including consumer electronics, automotive systems, industrial automation, and more.It is important to note that the specific advantages and application scenarios of the HC55171CB chip may vary depending on its intended purpose and design specifications. To obtain accurate and detailed information about this chip, it is recommended to refer to the manufacturer's datasheet or contact the manufacturer directly.
HC55171CB Relevant information