HC55171CB

HC55171CB

Manufacturer No:

HC55171CB

Manufacturer:

Harris Corporation

Description:

5 REN RINGING SLIC FOR ISDN

Datasheet:

Datasheet

Delivery:

Payment:

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HC55171CB Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 75°C
  • Power (Watts)
    300 mW
  • Current - Supply
    6mA
  • Voltage - Supply
    -16V ~ -80V, 4.75V ~ 5.25V
  • Number of Circuits
    1
  • Interface
    2-Wire, 4-Wire
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The HC55171CB is a specific integrated circuit (IC) chip that belongs to the HC5517x family of ICs. Unfortunately, there is limited information available about this specific chip, and it is not widely known or used. As a result, it is challenging to provide specific advantages and application scenarios for the HC55171CB.However, in general, IC chips like the HC5517x family are designed for various applications in the field of electronics. Some potential advantages and application scenarios of IC chips could include:1. Compact Size: IC chips are typically small in size, allowing for space-saving designs in electronic devices. 2. Integration: IC chips often integrate multiple functions or components into a single chip, reducing the need for additional external components. 3. Power Efficiency: IC chips are designed to be power-efficient, helping to extend battery life in portable devices. 4. Cost-Effectiveness: IC chips are mass-produced, leading to cost savings in manufacturing and assembly processes. 5. Versatility: IC chips can be used in a wide range of applications, including consumer electronics, automotive systems, industrial automation, and more.It is important to note that the specific advantages and application scenarios of the HC55171CB chip may vary depending on its intended purpose and design specifications. To obtain accurate and detailed information about this chip, it is recommended to refer to the manufacturer's datasheet or contact the manufacturer directly.