Home / Telecom / HC5526CP/
HC5526CP

HC5526CP

Manufacturer No:

HC5526CP

Manufacturer:

Harris Corporation

Description:

ITU CO/PABX SLIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

HC5526CP Specifications

  • Type
    Parameter
  • Supplier Device Package
    22-PDIP
  • Package / Case
    22-DIP (0.400", 10.16mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C
  • Power (Watts)
    1.5 W
  • Current - Supply
    5.5mA
  • Voltage - Supply
    4.75V ~ 5.25V
  • Number of Circuits
    1
  • Interface
    2-Wire, 4-Wire
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Bag
  • Product Status
    Obsolete
  • Series
    -
The HC5526CP is a specific integrated circuit (IC) chip that is used in various applications. However, without more specific information about the chip, it is difficult to provide a comprehensive list of advantages and application scenarios. Generally, IC chips offer several advantages, including:1. Miniaturization: IC chips are compact and can integrate multiple functions into a single chip, reducing the size and complexity of electronic devices. 2. Power efficiency: IC chips are designed to operate with low power consumption, making them suitable for battery-powered devices. 3. Reliability: IC chips are manufactured using advanced processes, ensuring high reliability and long-term performance. 4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them affordable for various applications.As for the application scenarios of the HC5526CP chip, it is necessary to refer to the datasheet or specific documentation provided by the manufacturer. The datasheet typically outlines the chip's features, pin configuration, and recommended applications. By understanding these details, one can determine the specific scenarios where the HC5526CP chip can be used effectively.
HC5526CP Relevant information