SI3050-E1-FT
Manufacturer No:
SI3050-E1-FT
Manufacturer:
Description:
IC TELECOM INTERFACE 20TSSOP
Datasheet:
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In Stock : 5700
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SI3050-E1-FT Specifications
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TypeParameter
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Supplier Device Package20-TSSOP
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Package / Case20-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C
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Current - Supply8.5mA
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Voltage - Supply3V ~ 3.6V
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Number of Circuits1
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InterfaceGCI, PCM, SPI
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FunctionDirect Access Arrangement (DAA)
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PackagingTube
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Product StatusActive
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Series-
The SI3050-E1-FT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SI3050-E1-FT chips offer high-performance capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to consume low power, making them energy-efficient and suitable for battery-powered devices. 3. Small Form Factor: The chips are compact and come in a small form factor, making them suitable for space-constrained applications. 4. Wide Operating Range: The SI3050-E1-FT chips can operate over a wide range of voltages and temperatures, making them versatile and suitable for various environments. 5. Robust Communication: These chips provide robust communication capabilities, enabling reliable data transmission in various applications.Application Scenarios: 1. Internet of Things (IoT): The SI3050-E1-FT chips can be used in IoT devices for wireless communication, enabling connectivity and data exchange between devices. 2. Smart Home Automation: These chips can be used in smart home automation systems to enable wireless communication between various devices, such as sensors, actuators, and controllers. 3. Industrial Automation: The chips can be used in industrial automation systems for wireless communication between different components, enabling efficient control and monitoring of industrial processes. 4. Healthcare Monitoring: The SI3050-E1-FT chips can be used in healthcare monitoring devices, such as wearable sensors or remote patient monitoring systems, to enable wireless data transmission for real-time monitoring and analysis. 5. Automotive Applications: These chips can be used in automotive applications for wireless communication between different components, such as sensors, control units, and infotainment systems, enabling advanced features like vehicle-to-vehicle communication or remote diagnostics.Overall, the SI3050-E1-FT integrated circuit chips offer high-performance wireless communication capabilities, making them suitable for a wide range of applications in various industries.
SI3050-E1-FT Relevant information