SI3050-E1-FT

SI3050-E1-FT

Manufacturer No:

SI3050-E1-FT

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SI3050-E1-FT Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    8.5mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    GCI, PCM, SPI
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The SI3050-E1-FT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SI3050-E1-FT chips offer high-performance capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to consume low power, making them energy-efficient and suitable for battery-powered devices. 3. Small Form Factor: The chips are compact and come in a small form factor, making them suitable for space-constrained applications. 4. Wide Operating Range: The SI3050-E1-FT chips can operate over a wide range of voltages and temperatures, making them versatile and suitable for various environments. 5. Robust Communication: These chips provide robust communication capabilities, enabling reliable data transmission in various applications.Application Scenarios: 1. Internet of Things (IoT): The SI3050-E1-FT chips can be used in IoT devices for wireless communication, enabling connectivity and data exchange between devices. 2. Smart Home Automation: These chips can be used in smart home automation systems to enable wireless communication between various devices, such as sensors, actuators, and controllers. 3. Industrial Automation: The chips can be used in industrial automation systems for wireless communication between different components, enabling efficient control and monitoring of industrial processes. 4. Healthcare Monitoring: The SI3050-E1-FT chips can be used in healthcare monitoring devices, such as wearable sensors or remote patient monitoring systems, to enable wireless data transmission for real-time monitoring and analysis. 5. Automotive Applications: These chips can be used in automotive applications for wireless communication between different components, such as sensors, control units, and infotainment systems, enabling advanced features like vehicle-to-vehicle communication or remote diagnostics.Overall, the SI3050-E1-FT integrated circuit chips offer high-performance wireless communication capabilities, making them suitable for a wide range of applications in various industries.