SI3050-E1-FM

SI3050-E1-FM

Manufacturer No:

SI3050-E1-FM

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 24QFN

Datasheet:

Datasheet

Delivery:

Payment:

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SI3050-E1-FM Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-QFN (4x4)
  • Package / Case
    24-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    8.5mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    GCI, PCM, SPI
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The SI3050-E1-FM integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low Power Consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. Small Form Factor: The chips are compact in size, allowing for easy integration into various electronic devices and systems. 3. High Performance: They offer high-performance capabilities, enabling efficient data processing and communication. 4. Wide Operating Range: The chips can operate over a wide range of voltages and temperatures, making them suitable for diverse environments and applications. 5. Robust Communication: They provide reliable and robust communication capabilities, ensuring seamless data transmission and reception.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices for wireless communication, sensor data processing, and connectivity. 2. Smart Home Automation: They can be employed in smart home systems for controlling and monitoring various devices and appliances. 3. Wearable Devices: The chips can be integrated into wearable devices like fitness trackers, smartwatches, and healthcare monitors for data processing and wireless communication. 4. Industrial Automation: They find applications in industrial automation systems for data acquisition, control, and communication. 5. Wireless Sensor Networks: The chips can be used in wireless sensor networks for collecting and transmitting data from multiple sensors to a central control unit. 6. Remote Monitoring and Control: They can be utilized in remote monitoring and control systems for real-time data transmission and control of remote devices or equipment.Overall, the SI3050-E1-FM integrated circuit chips offer low power consumption, small form factor, high performance, and robust communication capabilities, making them suitable for various applications in IoT, smart home automation, wearable devices, industrial automation, wireless sensor networks, and remote monitoring and control systems.