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SI3019-F-FSR

SI3019-F-FSR

Manufacturer No:

SI3019-F-FSR

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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SI3019-F-FSR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    8.5mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    GCI, PCM, SPI
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The SI3019-F-FSR integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: The SI3019-F-FSR chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. Small form factor: These chips are available in compact packages, allowing for space-saving designs and integration into small devices. 3. High integration: The SI3019-F-FSR chips offer a high level of integration, combining multiple functions into a single chip. This simplifies the design process and reduces the overall system cost. 4. Wide operating voltage range: These chips can operate over a wide range of voltage levels, making them suitable for various power supply configurations. 5. Robust communication capabilities: The SI3019-F-FSR chips support reliable and efficient communication protocols, enabling seamless data transfer between devices.Application scenarios: 1. Internet of Things (IoT): The SI3019-F-FSR chips can be used in IoT devices for wireless connectivity, enabling communication between sensors, actuators, and other IoT components. 2. Home automation: These chips can be utilized in smart home systems to enable wireless control and monitoring of various devices, such as lights, thermostats, and security systems. 3. Industrial automation: The SI3019-F-FSR chips can be employed in industrial automation applications, enabling wireless communication between different machines, sensors, and control systems. 4. Wearable devices: These chips can be integrated into wearable devices, such as fitness trackers and smartwatches, to enable wireless connectivity and data synchronization with smartphones or other devices. 5. Smart energy management: The SI3019-F-FSR chips can be used in energy management systems to enable wireless communication between smart meters, energy monitoring devices, and control systems, facilitating efficient energy usage and monitoring.Overall, the SI3019-F-FSR integrated circuit chips offer advantages such as low power consumption, small form factor, high integration, and robust communication capabilities, making them suitable for various applications in IoT, home automation, industrial automation, wearable devices, and smart energy management.
SI3019-F-FSR Relevant information