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MCZ33903BS3EKR2

MCZ33903BS3EKR2

Manufacturer No:

MCZ33903BS3EKR2

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 32SOIC

Datasheet:

Datasheet

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MCZ33903BS3EKR2 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    32-SSOP-EP
  • Package / Case
    32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Voltage - Supply
    5.5V ~ 28V
  • Interface
    CAN, LIN
  • Applications
    System Basis Chip
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MCZ33903BS3EKR2 is a highly integrated system basis chip (SBC) designed for automotive applications. It offers several advantages and can be used in various scenarios. Here are some of the advantages and application scenarios of the MCZ33903BS3EKR2:Advantages: 1. High Integration: The MCZ33903BS3EKR2 integrates multiple functions into a single chip, reducing the need for external components and saving board space. 2. Robustness: It is designed to meet the stringent requirements of the automotive industry, including high-temperature operation, electromagnetic compatibility (EMC), and electrostatic discharge (ESD) protection. 3. Flexibility: The chip supports a wide range of automotive communication protocols, such as LIN (Local Interconnect Network) and CAN (Controller Area Network), making it suitable for various automotive applications. 4. Low Power Consumption: The MCZ33903BS3EKR2 is designed to operate with low power consumption, making it suitable for battery-powered automotive systems.Application Scenarios: 1. Body Control Modules: The chip can be used in body control modules to control various functions like power windows, door locks, lighting, and climate control systems. It provides LIN communication interfaces for communication with other modules in the vehicle. 2. HVAC Systems: The MCZ33903BS3EKR2 can be used in heating, ventilation, and air conditioning (HVAC) systems to control fan speed, temperature, and other parameters. It enables communication with the main vehicle network through LIN or CAN interfaces. 3. Lighting Systems: It can be used in automotive lighting systems, such as headlamps, taillights, and interior lighting. The chip provides control interfaces for various lighting functions and supports communication with other modules. 4. Seat Control Modules: The chip can be used in seat control modules to control functions like seat adjustment, heating, and ventilation. It enables communication with other modules through LIN or CAN interfaces. 5. Door Modules: The MCZ33903BS3EKR2 can be used in door modules to control functions like power windows, door locks, mirrors, and lighting. It provides LIN communication interfaces for communication with other modules in the vehicle.These are just a few examples of the many possible applications and scenarios where the MCZ33903BS3EKR2 integrated circuit chip can be used. Its high integration, robustness, flexibility, and low power consumption make it a suitable choice for various automotive systems.
MCZ33903BS3EKR2 Relevant information