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MCZ33903BD3EKR2

MCZ33903BD3EKR2

Manufacturer No:

MCZ33903BD3EKR2

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 32SOIC

Datasheet:

Datasheet

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MCZ33903BD3EKR2 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    32-SSOP-EP
  • Package / Case
    32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Voltage - Supply
    5.5V ~ 28V
  • Interface
    CAN, LIN
  • Applications
    System Basis Chip
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MCZ33903BD3EKR2 is a highly integrated system basis chip (SBC) designed for automotive applications. It offers several advantages and can be used in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. High Integration: The MCZ33903BD3EKR2 integrates multiple functions into a single chip, reducing the need for external components and saving board space. 2. Robustness: It is designed to meet the stringent requirements of the automotive industry, including high-temperature operation, electromagnetic compatibility (EMC), and electrostatic discharge (ESD) protection. 3. Flexibility: The chip supports a wide range of automotive communication protocols, such as LIN (Local Interconnect Network) and CAN (Controller Area Network), making it suitable for different vehicle systems. 4. Diagnostic Features: It includes diagnostic capabilities, allowing for fault detection and reporting, which is crucial for automotive safety and maintenance. 5. Low Power Consumption: The MCZ33903BD3EKR2 is designed to operate efficiently with low power consumption, making it suitable for automotive applications where power efficiency is essential.Application Scenarios: 1. Body Control Modules: The chip can be used in body control modules to control various functions like lighting, power windows, door locks, and mirrors. Its LIN and CAN interfaces enable communication with other vehicle systems. 2. HVAC Systems: The MCZ33903BD3EKR2 can be utilized in heating, ventilation, and air conditioning (HVAC) systems to control fan speed, temperature, and other parameters. It enables communication with the main vehicle network for integration with other systems. 3. Seat Control: It can be employed in seat control modules to manage seat adjustments, heating, and ventilation. The chip's diagnostic features can help detect faults in the seat control system. 4. Powertrain Systems: The chip can be used in powertrain systems to control functions like fuel injection, ignition timing, and transmission. Its robustness and diagnostic capabilities ensure reliable operation and fault detection. 5. Lighting Systems: The MCZ33903BD3EKR2 can be utilized in lighting control modules to manage exterior and interior lighting functions. Its LIN interface allows for communication with other lighting modules and the central vehicle network.These are just a few examples of the advantages and application scenarios of the MCZ33903BD3EKR2 integrated circuit chips. Its versatility, robustness, and integration make it suitable for various automotive applications where communication, control, and diagnostics are required.
MCZ33903BD3EKR2 Relevant information