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MCZ33903BD3EK

MCZ33903BD3EK

Manufacturer No:

MCZ33903BD3EK

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 32SOIC

Datasheet:

Datasheet

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Payment:

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MCZ33903BD3EK Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    32-SSOP-EP
  • Package / Case
    32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Voltage - Supply
    5.5V ~ 28V
  • Interface
    CAN, LIN
  • Applications
    System Basis Chip
  • Packaging
    Box
  • Product Status
    Obsolete
  • Series
    -
The MCZ33903BD3EK is a highly integrated circuit chip designed for automotive applications. It offers several advantages and can be used in various scenarios. Some of the advantages and application scenarios of the MCZ33903BD3EK are:1. High integration: The chip integrates multiple functions into a single device, reducing the need for external components and saving space on the PCB.2. Robustness: It is designed to withstand the harsh automotive environment, including high temperatures, voltage transients, and electromagnetic interference.3. Flexibility: The chip supports a wide range of automotive applications, including body control modules, lighting control modules, and power distribution systems.4. Fault detection and diagnosis: It includes built-in diagnostic features that can detect and report faults in the system, enabling quick troubleshooting and maintenance.5. Low power consumption: The chip is designed to operate efficiently, minimizing power consumption and extending battery life in automotive applications.6. Enhanced safety: It incorporates safety features such as over-temperature protection, over-voltage protection, and short-circuit protection, ensuring the safety of the system and the vehicle.7. Communication protocols: The chip supports various communication protocols such as LIN (Local Interconnect Network) and SPI (Serial Peripheral Interface), enabling seamless integration with other automotive systems.Application scenarios of the MCZ33903BD3EK include:1. Automotive lighting control: The chip can be used in lighting control modules to control and monitor various lighting functions in a vehicle, including headlights, taillights, turn signals, and interior lighting.2. Power distribution systems: It can be used in power distribution modules to manage and distribute power to different components and subsystems in a vehicle, ensuring efficient and reliable power delivery.3. Body control modules: The chip can be utilized in body control modules to control various functions related to the vehicle's body, such as power windows, door locks, mirrors, and seat controls.4. HVAC (Heating, Ventilation, and Air Conditioning) systems: It can be employed in HVAC control modules to manage and regulate the temperature, airflow, and other parameters of the vehicle's climate control system.5. Seat control systems: The chip can be used in seat control modules to control and adjust the position, heating, and other functions of the vehicle's seats.Overall, the MCZ33903BD3EK integrated circuit chip offers a range of advantages and can be applied in various automotive systems to enhance functionality, reliability, and safety.
MCZ33903BD3EK Relevant information