Home / Specialized / TJA1081TS,112/
TJA1081TS,112

TJA1081TS,112

Manufacturer No:

TJA1081TS,112

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 16SSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TJA1081TS,112 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    16-SSOP
  • Package / Case
    16-SSOP (0.209", 5.30mm Width)
  • Voltage - Supply
    4.75V ~ 5.25V
  • Interface
    FlexRay
  • Applications
    Automotive
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The TJA1081TS,112 is an integrated circuit chip designed for use in automotive applications. It is specifically used for LIN (Local Interconnect Network) communication in vehicles. Here are some advantages and application scenarios of this chip:Advantages: 1. LIN Communication: The TJA1081TS,112 chip enables reliable and efficient communication over the LIN bus, which is commonly used for various automotive applications such as body control modules, door modules, seat control modules, and more. 2. Low Power Consumption: This chip is designed to operate with low power consumption, making it suitable for automotive systems where energy efficiency is crucial. 3. Robustness: It offers robust communication capabilities, ensuring reliable data transmission even in noisy automotive environments. 4. ESD Protection: The chip provides built-in electrostatic discharge (ESD) protection, safeguarding the LIN bus and the connected devices from potential damage due to electrostatic discharges.Application Scenarios: 1. Automotive Body Control Modules: The TJA1081TS,112 chip can be used in body control modules to facilitate communication between various components such as door locks, window controls, lighting systems, and more. 2. Seat Control Modules: It can be employed in seat control modules to enable communication between the seat adjustment controls and the seat motors, allowing for precise and synchronized seat adjustments. 3. Door Modules: The chip can be utilized in door modules to establish communication between the central control unit and various door components like power windows, central locking systems, mirror controls, etc. 4. HVAC Systems: It can be integrated into heating, ventilation, and air conditioning (HVAC) systems to enable communication between the control unit and various HVAC components, ensuring efficient climate control in vehicles.Overall, the TJA1081TS,112 chip offers reliable and efficient LIN communication, making it suitable for various automotive applications that require robust and low-power communication capabilities.
TJA1081TS,112 Relevant information