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MC33689DDWB

MC33689DDWB

Manufacturer No:

MC33689DDWB

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 32SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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MC33689DDWB Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    32-SOIC
  • Package / Case
    32-BSSOP (0.295", 7.50mm Width)
  • Voltage - Supply
    5.5V ~ 18V
  • Interface
    SPI Serial
  • Applications
    Automotive Mirror Control
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The MC33689DDWB is an integrated circuit chip designed for automotive applications. It is specifically used for LIN (Local Interconnect Network) communication in automotive systems. Here are some advantages and application scenarios of the MC33689DDWB:Advantages: 1. LIN Communication: The chip provides a reliable and cost-effective solution for LIN communication in automotive systems. It supports LIN protocol versions 1.3, 2.0, and 2.1, making it compatible with a wide range of LIN networks. 2. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for automotive applications where power efficiency is crucial. 3. Robustness: It offers enhanced robustness against electromagnetic interference (EMI) and electrostatic discharge (ESD), ensuring reliable communication in automotive environments. 4. Integrated Features: The chip integrates various features like voltage regulator, LIN transceiver, and wake-up capability, reducing the need for external components and simplifying the design process.Application Scenarios: 1. Automotive Body Control Modules: The MC33689DDWB chip can be used in body control modules to enable communication between various components like door locks, window controls, lighting systems, and more. It allows for efficient control and monitoring of these systems. 2. Automotive Climate Control Systems: It can be utilized in climate control systems to facilitate communication between the control unit and various sensors, actuators, and switches. This enables precise temperature control and efficient operation of the climate control system. 3. Automotive Lighting Systems: The chip can be employed in lighting systems to enable communication between the control unit and various lighting components like headlights, taillights, indicators, etc. It allows for advanced lighting functionalities and control. 4. Automotive Seat Control Systems: It can be used in seat control systems to enable communication between the control unit and various seat components like motors, sensors, and switches. This allows for precise seat adjustments and enhanced comfort features.Overall, the MC33689DDWB integrated circuit chip offers advantages like reliable LIN communication, low power consumption, robustness, and integrated features, making it suitable for various automotive applications requiring LIN communication.
MC33689DDWB Relevant information