Home / Specialized / MCZ33903C3EKR2/
MCZ33903C3EKR2

MCZ33903C3EKR2

Manufacturer No:

MCZ33903C3EKR2

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 32SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MCZ33903C3EKR2 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    32-SOIC-EP
  • Package / Case
    32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Voltage - Supply
    5.5V ~ 28V
  • Interface
    CAN
  • Applications
    System Basis Chip
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MCZ33903C3EKR2 is a highly integrated system basis chip (SBC) designed for automotive applications. It offers several advantages and can be used in various scenarios. Here are some of the advantages and application scenarios of the MCZ33903C3EKR2:Advantages: 1. High Integration: The MCZ33903C3EKR2 integrates multiple functions into a single chip, reducing the need for external components and saving board space. 2. Robustness: It is designed to meet the stringent requirements of the automotive industry, including high-temperature operation, electromagnetic compatibility (EMC), and electrostatic discharge (ESD) protection. 3. Flexibility: The chip supports a wide range of automotive communication protocols, such as LIN (Local Interconnect Network) and CAN (Controller Area Network), making it suitable for various automotive applications. 4. Low Power Consumption: The MCZ33903C3EKR2 is designed to operate with low power consumption, making it suitable for battery-powered automotive systems.Application Scenarios: 1. Body Control Modules: The MCZ33903C3EKR2 can be used in body control modules to control various functions like lighting, power windows, door locks, and mirrors. It provides LIN communication interfaces for communication with other modules in the vehicle. 2. HVAC Systems: It can be used in heating, ventilation, and air conditioning (HVAC) systems to control fan speed, temperature, and other parameters. The chip's LIN interface allows communication with the main vehicle network. 3. Seat Control Systems: The MCZ33903C3EKR2 can be used in seat control systems to control seat movement, heating, and ventilation. It provides LIN interfaces for communication with other modules in the vehicle. 4. Door Modules: It can be used in door modules to control power windows, door locks, and mirrors. The chip's LIN interface allows communication with the main vehicle network. 5. Lighting Systems: The MCZ33903C3EKR2 can be used in lighting systems to control various lighting functions, such as headlights, taillights, and interior lighting. It provides LIN interfaces for communication with other modules in the vehicle.These are just a few examples of the application scenarios where the MCZ33903C3EKR2 can be used. Its high integration, robustness, flexibility, and low power consumption make it a suitable choice for various automotive applications.
MCZ33903C3EKR2 Relevant information