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PI7C8150BNDI

PI7C8150BNDI

Manufacturer No:

PI7C8150BNDI

Manufacturer:

Diodes Incorporated

Description:

IC INTERFACE SPECIALIZED 256BGA

Datasheet:

Datasheet

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PI7C8150BNDI Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    256-PBGA (17x17)
  • Package / Case
    256-BGA
  • Voltage - Supply
    3V ~ 3.6V
  • Interface
    -
  • Applications
    PCI-to-PCI Bridge
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The PI7C8150BNDI is a high-performance integrated circuit chip designed for PCI Express (PCIe) to USB 3.0 bridge applications. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the PI7C8150BNDI chip are:1. High-speed data transfer: The chip supports PCIe Gen2 x1 interface, enabling high-speed data transfer between PCIe and USB 3.0 interfaces. This makes it suitable for applications requiring fast data transfer rates.2. USB 3.0 compatibility: The chip is designed to bridge the gap between PCIe and USB 3.0 interfaces, allowing seamless communication between the two. It supports USB 3.0 SuperSpeed (5 Gbps) and backward compatibility with USB 2.0 and USB 1.1 devices.3. Multiple USB ports: The PI7C8150BNDI chip supports up to four downstream USB 3.0 ports, providing flexibility in connecting multiple USB devices simultaneously.4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for power-sensitive applications such as portable devices and embedded systems.5. Hot-plug support: The chip supports hot-plug functionality, allowing USB devices to be connected or disconnected while the system is running. This feature is useful in scenarios where devices need to be added or removed without system restart.6. Industrial and automotive applications: The PI7C8150BNDI chip is designed to meet the requirements of industrial and automotive applications. It can withstand harsh operating conditions, including wide temperature ranges and high vibration environments.7. Expansion cards and docking stations: The chip can be used in expansion cards and docking stations to provide USB 3.0 connectivity to systems that lack native USB 3.0 support. This allows users to upgrade their systems with USB 3.0 capabilities.8. Embedded systems: The chip can be integrated into embedded systems, such as industrial computers, kiosks, and digital signage, to enable USB 3.0 connectivity and high-speed data transfer.Overall, the PI7C8150BNDI integrated circuit chip offers high-performance PCIe to USB 3.0 bridging capabilities, making it suitable for a wide range of applications that require fast data transfer, multiple USB ports, low power consumption, and compatibility with USB 3.0 devices.
PI7C8150BNDI Relevant information