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MC33660EFR2

MC33660EFR2

Manufacturer No:

MC33660EFR2

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 8SOIC

Datasheet:

Datasheet

Delivery:

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MC33660EFR2 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Voltage - Supply
    8V ~ 18V
  • Interface
    Serial Link Bus Interface
  • Applications
    Automotive
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MC33660EFR2 is an integrated circuit chip designed for automotive applications. It is specifically used for LIN (Local Interconnect Network) communication in vehicles. Here are some advantages and application scenarios of the MC33660EFR2:Advantages: 1. LIN Communication: The chip provides a reliable and cost-effective solution for LIN communication in automotive systems. It supports the LIN protocol, which is widely used for communication between various electronic control units (ECUs) in vehicles.2. Low Power Consumption: The MC33660EFR2 is designed to operate with low power consumption, making it suitable for automotive applications where power efficiency is crucial.3. Robustness: The chip is designed to withstand the harsh automotive environment, including temperature variations, electromagnetic interference, and voltage fluctuations. It has built-in protection features to ensure reliable communication even in challenging conditions.4. Integrated Features: The MC33660EFR2 integrates various features required for LIN communication, such as LIN transceiver, voltage regulator, and wake-up functionality. This integration reduces the need for external components and simplifies the design process.Application Scenarios: 1. Automotive Body Control Modules: The MC33660EFR2 can be used in body control modules (BCMs) to enable communication between different components, such as door locks, window controls, and lighting systems. It allows for centralized control and monitoring of these functions.2. Infotainment Systems: The chip can be used in infotainment systems to facilitate communication between the head unit, display, and various peripherals. It enables control of audio, video, and other multimedia functions in the vehicle.3. Climate Control Systems: The MC33660EFR2 can be utilized in climate control systems to enable communication between the control unit, temperature sensors, and actuators. It allows for precise control of heating, ventilation, and air conditioning (HVAC) functions.4. Lighting Control: The chip can be employed in lighting control systems to enable communication between the control unit and various lighting components, such as headlights, taillights, and interior lighting. It enables advanced lighting features and customization options.Overall, the MC33660EFR2 integrated circuit chip offers a reliable and efficient solution for LIN communication in automotive applications, enhancing the functionality and performance of various vehicle systems.
MC33660EFR2 Relevant information