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DS33W11DK+

DS33W11DK+

Manufacturer No:

DS33W11DK+

Description:

IC INTFACE SPECIALIZED 256CSBGA

Datasheet:

Datasheet

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DS33W11DK+ Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    256-CSBGA (17x17)
  • Package / Case
    256-LBGA, CSBGA
  • Voltage - Supply
    1.8V, 2.5V, 3.3V
  • Interface
    Parallel/Serial
  • Applications
    Data Transport
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The DS33W11DK+ integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of DS33W11DK+ chips are:1. High-speed data transmission: The DS33W11DK+ chips support high-speed data transmission up to 11.3 Gbps, making them suitable for applications that require fast and reliable data transfer.2. Low power consumption: These chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial.3. Signal conditioning and equalization: The DS33W11DK+ chips provide signal conditioning and equalization capabilities, allowing them to compensate for signal degradation and improve the quality of transmitted data.4. Long-distance communication: With their high-speed and signal conditioning features, these chips can be used in applications that require long-distance communication, such as high-speed networking, telecommunications, or data centers.5. Industrial applications: The DS33W11DK+ chips are suitable for industrial applications that require reliable and high-speed data transmission, such as industrial automation, robotics, or control systems.6. Consumer electronics: These chips can be used in various consumer electronic devices, including high-definition displays, gaming consoles, virtual reality systems, or high-speed data interfaces.7. Medical devices: The DS33W11DK+ chips can be applied in medical devices that require high-speed data transfer, such as medical imaging systems, patient monitoring devices, or telemedicine applications.8. Automotive applications: With their high-speed and low power consumption features, these chips can be used in automotive applications, including infotainment systems, advanced driver-assistance systems (ADAS), or in-vehicle networking.Overall, the DS33W11DK+ integrated circuit chips offer advantages like high-speed data transmission, low power consumption, and signal conditioning, making them suitable for a wide range of applications in various industries.
DS33W11DK+ Relevant information