DS33X162+

DS33X162+

Manufacturer No:

DS33X162+

Description:

IC INTFACE SPECIALIZED 256CSBGA

Datasheet:

Datasheet

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DS33X162+ Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    256-CSBGA (17x17)
  • Package / Case
    256-LBGA, CSBGA
  • Voltage - Supply
    1.8V, 2.5V, 3.3V
  • Interface
    Parallel/Serial
  • Applications
    Data Transport
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The DS33X162+ integrated circuit chips offer several advantages and can be applied in various scenarios:1. High-Speed Data Transmission: These chips are designed for high-speed data transmission applications, offering data rates up to 12.5 Gbps. They provide reliable and efficient data transfer, making them suitable for applications that require fast and accurate data transmission.2. Low Power Consumption: The DS33X162+ chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. They help in extending the battery life of portable devices.3. Signal Conditioning and Equalization: These chips incorporate advanced signal conditioning and equalization techniques to compensate for signal degradation over long transmission lines or in the presence of noise. They help in improving signal integrity and reducing errors in data transmission.4. Flexible Configuration: The DS33X162+ chips offer flexible configuration options, allowing users to adjust various parameters such as equalization, de-emphasis, and output swing to optimize the performance based on specific application requirements.5. Wide Range of Applications: These chips find applications in various scenarios, including high-speed data communication systems, networking equipment, data centers, telecommunications, video broadcasting, and other industries where high-speed and reliable data transmission is essential.Overall, the DS33X162+ integrated circuit chips provide high-speed data transmission, low power consumption, signal conditioning, and flexibility, making them suitable for a wide range of applications that require reliable and efficient data transfer.