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DS33Z11+

DS33Z11+

Manufacturer No:

DS33Z11+

Description:

IC INTFACE SPECIALIZED 169CSBGA

Datasheet:

Datasheet

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DS33Z11+ Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    169-CSBGA (14x14)
  • Package / Case
    169-LBGA, CSPBGA
  • Voltage - Supply
    1.8V, 3.3V
  • Interface
    SPI/Parallel
  • Applications
    Data Transport
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The DS33Z11+ integrated circuit chips offer several advantages and can be applied in various scenarios:1. High-speed data transmission: The DS33Z11+ chips are designed for high-speed data transmission applications, supporting data rates up to 12.5 Gbps. This makes them suitable for applications that require fast and reliable data transfer, such as high-speed networking, telecommunications, and data centers.2. Low power consumption: These chips are designed with low power consumption in mind, making them energy-efficient. This is particularly beneficial for portable devices or applications where power efficiency is crucial, such as mobile devices, battery-powered systems, or IoT devices.3. Signal conditioning and equalization: The DS33Z11+ chips provide advanced signal conditioning and equalization features. They can compensate for signal distortions and attenuations that occur during transmission, ensuring high-quality and reliable data transmission over long distances. This makes them suitable for applications that require long-range data transmission, such as fiber optic communication systems or high-speed serial links.4. Flexible configuration options: These chips offer various configuration options, allowing users to customize and optimize their performance according to specific application requirements. They provide adjustable equalization, de-emphasis, and output swing control, enabling fine-tuning of signal characteristics for optimal performance.5. Wide operating temperature range: The DS33Z11+ chips are designed to operate reliably over a wide temperature range, typically from -40°C to +85°C. This makes them suitable for applications that require operation in harsh environments or extreme temperature conditions.Overall, the DS33Z11+ integrated circuit chips are advantageous for high-speed data transmission, low power consumption, signal conditioning, and equalization. They can be applied in various scenarios, including networking, telecommunications, data centers, fiber optic communication systems, mobile devices, battery-powered systems, IoT devices, and applications requiring long-range data transmission.
DS33Z11+ Relevant information