DS110DF1610FBE/NOPB

DS110DF1610FBE/NOPB

Manufacturer No:

DS110DF1610FBE/NOPB

Manufacturer:

Texas Instruments

Description:

IC INTFACE SPECIALIZED 196FCBGA

Datasheet:

Datasheet

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DS110DF1610FBE/NOPB Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    196-FCBGA (15x15)
  • Package / Case
    196-BBGA
  • Voltage - Supply
    2.375V ~ 2.625V
  • Interface
    SMBus
  • Applications
    Retimer
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The DS110DF1610FBE/NOPB is a high-performance, low-power, and low-latency integrated circuit chip designed for signal conditioning and equalization in high-speed data communication systems. Some of the advantages and application scenarios of this chip are:1. High-speed data communication: The DS110DF1610FBE/NOPB chip supports data rates up to 16 Gbps, making it suitable for high-speed communication systems such as data centers, telecommunications, and high-performance computing.2. Signal conditioning: The chip provides advanced signal conditioning features like equalization, pre-emphasis, and de-emphasis. These features help compensate for signal degradation and improve the overall signal integrity, allowing for longer transmission distances and higher data rates.3. Low power consumption: The chip is designed with low-power circuitry, enabling energy-efficient operation. This is particularly important in power-sensitive applications where minimizing power consumption is crucial.4. Low latency: The DS110DF1610FBE/NOPB chip offers low latency, ensuring minimal delay in signal transmission. This is essential in applications that require real-time data processing, such as high-frequency trading, video streaming, and gaming.5. Backplane communication: The chip is commonly used in backplane communication systems, where it helps to compensate for signal distortion and loss that occur during transmission over printed circuit boards (PCBs). It enables reliable and high-speed data transfer between various components in a system.6. Optical communication: The chip can also be used in optical communication systems, where it helps to condition and equalize signals transmitted over fiber-optic cables. It enhances the performance and reliability of optical communication links.7. Test and measurement equipment: The DS110DF1610FBE/NOPB chip is often utilized in test and measurement equipment, such as oscilloscopes and network analyzers. It aids in signal conditioning and equalization, allowing accurate measurement and analysis of high-speed signals.Overall, the DS110DF1610FBE/NOPB integrated circuit chip offers high-speed signal conditioning, low power consumption, low latency, and is suitable for a wide range of applications in data communication, backplane communication, optical communication, and test and measurement equipment.