XIO1100ZWS

XIO1100ZWS

Manufacturer No:

XIO1100ZWS

Manufacturer:

Texas Instruments

Description:

IC ISOLATION

Datasheet:

Datasheet

Delivery:

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XIO1100ZWS Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    100-NFBGA (12x12)
  • Package / Case
    100-LFBGA
  • Voltage - Supply
    1.35V ~ 1.65V, 3V ~ 3.6V
  • Interface
    TI-PIPE
  • Applications
    PCI Express to PCI Translation Bridge
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The XIO1100ZWS integrated circuit chips have several advantages and application scenarios:1. High-speed data transfer: The XIO1100ZWS chips support USB 3.0 and USB 2.0 protocols, enabling high-speed data transfer rates of up to 5 Gbps. This makes them suitable for applications that require fast data transfer, such as external hard drives, high-resolution cameras, and video streaming devices.2. Power efficiency: These chips are designed to be power-efficient, consuming minimal power during operation. This makes them ideal for portable devices like smartphones, tablets, and laptops, where power consumption is a critical factor.3. Compact size: The XIO1100ZWS chips are compact in size, making them suitable for integration into small form factor devices. They can be used in various applications, including IoT devices, wearable technology, and embedded systems.4. Plug-and-play compatibility: These chips are designed to be plug-and-play compatible, meaning they can be easily connected to a host device without the need for additional drivers or software installations. This simplifies the integration process and enhances the user experience.5. Wide range of applications: The XIO1100ZWS chips can be used in a wide range of applications, including data storage devices, digital cameras, printers, gaming consoles, and industrial automation systems. They provide a reliable and efficient solution for data transfer and communication between devices.Overall, the XIO1100ZWS integrated circuit chips offer high-speed data transfer, power efficiency, compact size, plug-and-play compatibility, and a wide range of applications. These features make them suitable for various industries and devices that require fast and reliable data transfer capabilities.