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MCZ33780EGR2

MCZ33780EGR2

Manufacturer No:

MCZ33780EGR2

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 16SOIC

Datasheet:

Datasheet

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MCZ33780EGR2 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Voltage - Supply
    -
  • Interface
    SPI
  • Applications
    -
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Not For New Designs
  • Series
    -
The MCZ33780EGR2 is an integrated circuit chip designed for automotive applications. It is specifically used for LIN (Local Interconnect Network) communication in automotive systems. Here are some advantages and application scenarios of the MCZ33780EGR2:Advantages: 1. LIN Communication: The chip supports LIN bus communication, which is a widely used protocol in automotive applications. It enables communication between various electronic control units (ECUs) in a vehicle, such as body control modules, door modules, seat modules, etc.2. Low Power Consumption: The MCZ33780EGR2 is designed to operate at low power, making it suitable for automotive systems where power efficiency is crucial. It helps in reducing overall power consumption and extending battery life.3. Robustness and Reliability: The chip is designed to withstand the harsh automotive environment, including temperature variations, electromagnetic interference, and voltage fluctuations. It ensures reliable communication even in challenging conditions.4. Integrated Features: The MCZ33780EGR2 integrates various features like voltage regulator, LIN transceiver, and wake-up functionality. This integration reduces the need for external components, simplifies the design, and saves board space.Application Scenarios: 1. Automotive Body Control Modules: The chip can be used in body control modules to enable communication between various components like door locks, window controls, lighting systems, etc. It allows centralized control and monitoring of these functions.2. Seat Control Modules: In automotive seat control modules, the MCZ33780EGR2 can facilitate communication between seat adjustment motors, heating/cooling systems, and other seat-related functions. It enables control and customization of seat settings.3. Door Modules: The chip can be used in door modules to enable communication between door locks, window controls, mirror adjustments, and other door-related functions. It allows centralized control and monitoring of these functions.4. HVAC Systems: The MCZ33780EGR2 can be used in heating, ventilation, and air conditioning (HVAC) systems to enable communication between various components like blower motors, temperature sensors, and control panels. It allows centralized control and monitoring of HVAC functions.Overall, the MCZ33780EGR2 integrated circuit chip offers advantages like LIN communication support, low power consumption, robustness, and integrated features. It finds application in various automotive systems where reliable communication and control are required.
MCZ33780EGR2 Relevant information