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MCZ33905DS3EK

MCZ33905DS3EK

Manufacturer No:

MCZ33905DS3EK

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 32SOIC

Datasheet:

Datasheet

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MCZ33905DS3EK Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    32-SOIC-EP
  • Package / Case
    32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Voltage - Supply
    5.5V ~ 28V
  • Interface
    CAN, LIN
  • Applications
    System Basis Chip
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MCZ33905DS3EK is a highly integrated system basis chip (SBC) designed for automotive applications. It offers several advantages and can be used in various scenarios. Here are some of the advantages and application scenarios of the MCZ33905DS3EK integrated circuit chips:Advantages: 1. High Integration: The MCZ33905DS3EK integrates multiple functions into a single chip, including power supply, communication interfaces, and various control functions. This high level of integration reduces the overall system complexity and cost.2. Robustness: The chip is designed to meet the stringent requirements of the automotive industry, making it highly reliable and robust. It can withstand harsh environmental conditions, such as temperature variations, vibrations, and electromagnetic interference.3. Flexibility: The MCZ33905DS3EK supports a wide range of automotive communication protocols, including LIN (Local Interconnect Network) and SENT (Single Edge Nibble Transmission). This flexibility allows it to be used in different automotive systems and applications.4. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for automotive applications where energy efficiency is crucial.Application Scenarios: 1. Body Control Modules: The MCZ33905DS3EK can be used in body control modules (BCMs) to control various functions related to the vehicle's body, such as lighting, door locks, windows, and mirrors. Its integrated features and communication interfaces make it an ideal choice for such applications.2. HVAC Systems: The chip can be used in heating, ventilation, and air conditioning (HVAC) systems to control and monitor temperature, fan speed, and other HVAC-related functions. Its robustness and communication capabilities make it suitable for such applications.3. Seat Control Systems: The MCZ33905DS3EK can be used in seat control systems to control seat adjustments, heating, and ventilation. Its low power consumption and communication capabilities make it a good fit for such applications.4. Instrument Clusters: The chip can be used in instrument clusters to control and monitor various vehicle parameters, such as speed, fuel level, and engine temperature. Its integration and communication features make it suitable for such applications.Overall, the MCZ33905DS3EK integrated circuit chips offer advantages like high integration, robustness, flexibility, and low power consumption, making them suitable for various automotive applications.
MCZ33905DS3EK Relevant information