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MCZ33903DS3EK

MCZ33903DS3EK

Manufacturer No:

MCZ33903DS3EK

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 32SOIC

Datasheet:

Datasheet

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MCZ33903DS3EK Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    32-SSOP-EP
  • Package / Case
    32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Voltage - Supply
    5.5V ~ 28V
  • Interface
    CAN, LIN
  • Applications
    System Basis Chip
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MCZ33903DS3EK is a highly integrated system basis chip (SBC) designed for automotive applications. It offers several advantages and can be used in various scenarios. Here are some of the advantages and application scenarios of the MCZ33903DS3EK integrated circuit chips:Advantages: 1. High Integration: The MCZ33903DS3EK integrates multiple functions into a single chip, reducing the need for external components and saving board space. 2. Robustness: It is designed to meet the stringent requirements of the automotive industry, including high-temperature operation, electromagnetic compatibility (EMC), and electrostatic discharge (ESD) protection. 3. Flexibility: The chip supports a wide range of automotive communication protocols, such as LIN (Local Interconnect Network) and CAN (Controller Area Network), making it suitable for various automotive applications. 4. Low Power Consumption: The MCZ33903DS3EK is designed to operate with low power consumption, making it suitable for battery-powered automotive systems.Application Scenarios: 1. Automotive Body Control Modules: The MCZ33903DS3EK can be used in body control modules to control various functions like power windows, door locks, mirrors, and lighting systems. It provides LIN or CAN interfaces for communication with other modules in the vehicle. 2. Automotive Lighting Systems: The chip can be used in lighting control modules to manage the operation of headlights, taillights, turn signals, and other lighting functions. It can interface with LIN or CAN networks for communication and control. 3. Automotive HVAC Systems: The MCZ33903DS3EK can be utilized in heating, ventilation, and air conditioning (HVAC) control modules to manage temperature, fan speed, and airflow control. It can communicate with other modules in the vehicle through LIN or CAN interfaces. 4. Automotive Seat Control Systems: The chip can be employed in seat control modules to manage seat adjustments, heating, and ventilation functions. It can communicate with other modules using LIN or CAN protocols.Overall, the MCZ33903DS3EK integrated circuit chips offer high integration, robustness, flexibility, and low power consumption, making them suitable for various automotive applications requiring communication, control, and interface capabilities.
MCZ33903DS3EK Relevant information