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MCZ33903D3EKR2

MCZ33903D3EKR2

Manufacturer No:

MCZ33903D3EKR2

Manufacturer:

NXP USA Inc.

Description:

IC INTERFACE SPECIALIZED 32SOIC

Datasheet:

Datasheet

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MCZ33903D3EKR2 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    32-SOIC-EP
  • Package / Case
    32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Voltage - Supply
    5.5V ~ 28V
  • Interface
    CAN, LIN
  • Applications
    System Basis Chip
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MCZ33903D3EKR2 is a highly integrated system basis chip (SBC) designed for automotive applications. It offers several advantages and can be used in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. High Integration: The MCZ33903D3EKR2 integrates multiple functions into a single chip, reducing the need for external components and saving board space. 2. Robustness: It is designed to meet the stringent requirements of the automotive industry, including high-temperature operation, electromagnetic compatibility (EMC), and electrostatic discharge (ESD) protection. 3. Flexibility: The chip supports a wide range of automotive communication protocols, such as LIN (Local Interconnect Network) and CAN (Controller Area Network), making it suitable for different vehicle systems. 4. Diagnostic Features: It includes diagnostic capabilities, allowing for fault detection and reporting, which is crucial for automotive safety and maintenance. 5. Low Power Consumption: The MCZ33903D3EKR2 is designed to minimize power consumption, making it suitable for automotive applications where energy efficiency is important.Application Scenarios: 1. Body Control Modules: The chip can be used in body control modules to control various functions like lighting, power windows, door locks, and mirrors. Its LIN and CAN interfaces enable communication with other modules in the vehicle. 2. HVAC Systems: The MCZ33903D3EKR2 can be utilized in heating, ventilation, and air conditioning (HVAC) systems to control fan speed, temperature, and other parameters. It can communicate with the main vehicle network through LIN or CAN. 3. Seat Control: In automotive seat control systems, the chip can be used to manage seat adjustments, memory functions, and heating/cooling features. It can communicate with other modules using LIN or CAN protocols. 4. Lighting Systems: The chip can control various lighting functions in a vehicle, including headlights, taillights, turn signals, and interior lighting. It can interface with LIN or CAN networks to receive commands and provide status feedback. 5. Powertrain Control: The MCZ33903D3EKR2 can be employed in powertrain control modules to manage engine functions, transmission control, and other powertrain-related tasks. Its diagnostic features help in detecting and reporting faults.These are just a few examples of the advantages and application scenarios of the MCZ33903D3EKR2 integrated circuit chips. The versatility and robustness of this chip make it suitable for a wide range of automotive applications.
MCZ33903D3EKR2 Relevant information