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BD3376EFV-CE2

BD3376EFV-CE2

Manufacturer No:

BD3376EFV-CE2

Manufacturer:

Description:

IC INTFACE SPECIALIZED 30HTSSOP

Datasheet:

Datasheet

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BD3376EFV-CE2 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    30-HTSSOP-B
  • Package / Case
    30-VSSOP (0.220", 5.60mm Width) Exposed Pad
  • Voltage - Supply
    8V ~ 26V
  • Interface
    SPI
  • Applications
    Automotive
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The BD3376EFV-CE2 is a specific integrated circuit (IC) chip manufactured by ROHM Semiconductor. While I couldn't find detailed information about this specific chip, I can provide you with general advantages and application scenarios of IC chips.Advantages of IC chips: 1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Power efficiency: IC chips are designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 3. Reliability: IC chips are manufactured using advanced processes, ensuring high reliability and long-term performance. 4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications. 5. Performance: IC chips can offer high-speed processing, improved signal quality, and enhanced functionality compared to discrete components.Application scenarios of IC chips: 1. Consumer electronics: IC chips are widely used in smartphones, tablets, laptops, televisions, gaming consoles, and other consumer electronic devices. 2. Automotive: IC chips are utilized in various automotive applications, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and more. 3. Industrial automation: IC chips play a crucial role in industrial automation, controlling machinery, monitoring sensors, and enabling communication between different components. 4. Medical devices: IC chips are used in medical devices such as pacemakers, insulin pumps, diagnostic equipment, and monitoring systems. 5. Internet of Things (IoT): IC chips are essential for IoT devices, enabling connectivity, data processing, and control in smart homes, wearables, industrial IoT, and other IoT applications.It's important to note that the specific advantages and application scenarios of the BD3376EFV-CE2 chip may vary based on its intended purpose and specifications. For detailed information about this chip, it is recommended to refer to the manufacturer's datasheet or contact ROHM Semiconductor directly.
BD3376EFV-CE2 Relevant information