PI7C8150BNDIE
Manufacturer No:
PI7C8150BNDIE
Manufacturer:
Description:
IC INTERFACE SPECIALIZED 256BGA
Datasheet:
Delivery:
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In Stock : 70
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PI7C8150BNDIE Specifications
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TypeParameter
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Mounting TypeSurface Mount
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Supplier Device Package256-PBGA (17x17)
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Package / Case256-BGA
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Voltage - Supply3V ~ 3.6V
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Interface-
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ApplicationsPCI-to-PCI Bridge
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PackagingTube
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Product StatusActive
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Series-
The PI7C8150BNDIE is a high-performance integrated circuit chip designed for various applications. Some of its advantages and application scenarios include:1. High-speed data transfer: The PI7C8150BNDIE supports data transfer rates of up to 5 Gbps, making it suitable for high-speed applications such as USB 3.0 and PCIe Gen2.2. USB 3.0 hub controller: This chip can be used as a USB 3.0 hub controller, allowing multiple USB devices to be connected and controlled through a single USB port.3. PCIe-to-USB bridge: The PI7C8150BNDIE can act as a bridge between PCIe and USB interfaces, enabling seamless communication between devices using these different protocols.4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for portable devices and applications where power efficiency is crucial.5. Compact form factor: The PI7C8150BNDIE is available in a small form factor, making it suitable for space-constrained applications such as laptops, tablets, and embedded systems.6. Industrial applications: The chip's high-performance capabilities and robust design make it suitable for various industrial applications, including automation, robotics, and data acquisition systems.7. Consumer electronics: The PI7C8150BNDIE can be used in consumer electronics devices such as gaming consoles, smart TVs, and set-top boxes to enable high-speed data transfer and connectivity.8. Medical devices: The chip's low power consumption and high-speed capabilities make it suitable for medical devices such as diagnostic equipment, patient monitoring systems, and imaging devices.Overall, the PI7C8150BNDIE integrated circuit chip offers high-speed data transfer, low power consumption, and compact form factor, making it suitable for a wide range of applications in various industries.
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