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NB7NPQ7021MMUTXG Specifications
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TypeParameter
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Operating Temperature-40°C ~ 85°C (TA)
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Current - Supply130mA
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Voltage - Supply3.135V ~ 3.465V
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Capacitance - Input1.25 pF
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Signal ConditioningInput Equalization, Output De-Emphasis
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Delay Time110ps
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Number of Channels2
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Data Rate (Max)10Gbps
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OutputDifferential
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InputDifferential
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ApplicationsUSB
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TypeBuffer, ReDriver
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Supplier Device Package16-UQFN (3x3)
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Package / Case16-UFQFN Exposed Pad
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Mounting TypeSurface Mount
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PackagingBulk
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PackagingTape & Reel (TR)
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series-
The NB7NPQ7021MMUTXG is a specific integrated circuit (IC) chip manufactured by ON Semiconductor. It is a high-speed differential line driver/receiver designed for various applications. Some advantages and application scenarios of this chip are:Advantages: 1. High-speed operation: The chip supports data rates up to 2.5 Gbps, making it suitable for high-speed communication systems. 2. Low power consumption: It is designed to operate with low power consumption, making it energy-efficient. 3. Wide supply voltage range: The chip can operate with a supply voltage range of 3.0V to 3.6V, providing flexibility in different applications. 4. Small form factor: The chip comes in a compact package, making it suitable for space-constrained designs. 5. ESD protection: It provides built-in electrostatic discharge (ESD) protection, ensuring robustness against transient voltage events.Application scenarios: 1. High-speed data communication: The chip can be used in applications requiring high-speed data transmission, such as Gigabit Ethernet, Fibre Channel, or InfiniBand. 2. Networking equipment: It can be utilized in networking equipment like routers, switches, or network interface cards (NICs) to drive and receive high-speed differential signals. 3. Video transmission: The chip can be employed in video transmission systems, such as HDMI or DisplayPort interfaces, to ensure reliable and high-speed data transfer. 4. Industrial automation: It can be used in industrial automation systems where high-speed communication is required between different components or devices. 5. Test and measurement equipment: The chip can be integrated into test and measurement equipment to provide high-speed signal generation and analysis capabilities.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.
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