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MAX4951BECTP+TGH7

MAX4951BECTP+TGH7

Manufacturer No:

MAX4951BECTP+TGH7

Description:

IC REDRIVER ESATA 1CH 20TQFN

Datasheet:

Datasheet

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MAX4951BECTP+TGH7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TQFN (4x4)
  • Package / Case
    20-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    77mA
  • Voltage - Supply
    3V ~ 3.6V
  • Signal Conditioning
    Input Equalization, Output Pre-Emphasis
  • Delay Time
    150ps
  • Number of Channels
    1
  • Data Rate (Max)
    3Gbps
  • Output
    -
  • Input
    -
  • Applications
    eSATA
  • Type
    Buffer, ReDriver
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MAX4951BECTP+TGH7 is an integrated circuit chip designed for high-speed, low-power, and low-voltage applications. Some of its advantages and application scenarios include:1. High-Speed Data Transmission: The MAX4951BECTP+TGH7 chip supports high-speed data transmission up to 3.4 Gbps, making it suitable for applications that require fast and reliable data transfer, such as high-speed communication systems, data centers, and networking equipment.2. Low Power Consumption: This chip is designed to operate at low power, making it ideal for battery-powered devices or applications where power efficiency is crucial. It helps in extending the battery life of portable devices like smartphones, tablets, and wearables.3. Low-Voltage Operation: The MAX4951BECTP+TGH7 chip operates at low voltage levels, typically between 1.65V and 3.6V. This makes it compatible with a wide range of low-voltage systems, including mobile devices, IoT devices, and other battery-powered applications.4. ESD Protection: The chip provides built-in electrostatic discharge (ESD) protection, safeguarding the connected devices from potential damage caused by electrostatic discharge events. This feature is particularly important in applications where the chip is exposed to external ESD risks, such as in industrial environments or portable devices.5. Small Form Factor: The MAX4951BECTP+TGH7 chip comes in a compact package, allowing for easy integration into space-constrained designs. It is suitable for applications where size and weight are critical factors, such as mobile devices, portable electronics, and IoT devices.6. Communication Interfaces: The chip supports various communication interfaces, including LVDS (Low-Voltage Differential Signaling) and CML (Current Mode Logic). This makes it versatile and compatible with a wide range of communication protocols, enabling its use in applications like high-speed data transmission, video interfaces, and networking equipment.Overall, the MAX4951BECTP+TGH7 integrated circuit chip offers high-speed, low-power, and low-voltage capabilities, making it suitable for a wide range of applications that require reliable data transmission, power efficiency, and compact form factor.
MAX4951BECTP+TGH7 Relevant information