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FIN1102MTCX Specifications
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TypeParameter
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Capacitance - Input2.5 pF
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Supplier Device Package14-TSSOP
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Package / Case14-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Current - Supply23mA
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Voltage - Supply3V ~ 3.6V
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Signal Conditioning-
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Delay Time1.75ns
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Number of Channels2
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Data Rate (Max)800Mbps
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OutputLVDS
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InputLVDS, LVPECL
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ApplicationsLVDS
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TypeBuffer, ReDriver
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series-
The FIN1102MTCX is an integrated circuit chip that is commonly used in various applications related to communication and data transmission. Some of the advantages and application scenarios of this chip are:1. High-speed data transmission: The FIN1102MTCX chip is designed to support high-speed data transmission, making it suitable for applications that require fast and reliable communication.2. Low power consumption: This chip is designed to operate with low power consumption, making it ideal for battery-powered devices or applications where power efficiency is crucial.3. Small form factor: The FIN1102MTCX chip is available in a small form factor, which makes it suitable for applications with space constraints or where miniaturization is required.4. Wide operating voltage range: This chip can operate within a wide voltage range, allowing it to be used in various electronic systems with different power supply requirements.5. Application scenarios: The FIN1102MTCX chip is commonly used in applications such as high-speed data communication, optical networking, fiber optic transceivers, Ethernet switches, and other networking equipment.Overall, the FIN1102MTCX integrated circuit chip offers advantages such as high-speed data transmission, low power consumption, small form factor, and wide operating voltage range, making it suitable for various communication and networking applications.
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