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DS280DF810ABWR

DS280DF810ABWR

Manufacturer No:

DS280DF810ABWR

Manufacturer:

Texas Instruments

Description:

IC INTERFACE

Datasheet:

Datasheet

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DS280DF810ABWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    135-FCBGA (8x13)
  • Package / Case
    135-BFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Current - Supply
    1.036A
  • Voltage - Supply
    2.375V ~ 2.625V
  • Signal Conditioning
    Input Equalization
  • Delay Time
    -
  • Number of Channels
    8
  • Data Rate (Max)
    28.4Gbps
  • Output
    CML
  • Input
    CML
  • Applications
    -
  • Type
    Buffer, ReDriver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The DS280DF810ABWR is a high-speed signal conditioner and retimer integrated circuit chip designed for use in high-performance data communication systems. Some of the advantages and application scenarios of this chip are:1. High-speed data transmission: The DS280DF810ABWR supports data rates up to 28.05 Gbps per channel, making it suitable for high-speed data communication applications such as data centers, cloud computing, and high-performance computing.2. Signal conditioning and retiming: The chip provides signal conditioning and retiming capabilities, which help to improve signal integrity and reduce jitter in high-speed data transmission. This ensures reliable and error-free data transmission over long distances.3. Multiple protocol support: The DS280DF810ABWR supports various protocols such as PCIe Gen1/2/3/4/5, 10/25/40/50/100/200/400GbE, and OIF-CEI 3.0/4.0. This makes it versatile and suitable for a wide range of applications in different industries.4. Low power consumption: The chip is designed with low power consumption in mind, making it energy-efficient and suitable for power-sensitive applications.5. Compact form factor: The DS280DF810ABWR is available in a small form factor package, which makes it suitable for space-constrained applications such as high-density data centers and compact networking equipment.6. Backward compatibility: The chip is backward compatible with previous generations of devices, allowing for easy integration into existing systems and infrastructure.Some application scenarios where the DS280DF810ABWR can be used include:- Data centers: The chip can be used in high-speed interconnects within data centers to enable fast and reliable data transmission between servers, switches, and storage systems.- High-performance computing: The chip can be used in high-performance computing systems to ensure fast and accurate data transfer between processors, memory modules, and other components.- Telecommunications: The chip can be used in telecommunications equipment such as routers, switches, and optical transceivers to enable high-speed data transmission over long distances.- Test and measurement: The chip can be used in test and measurement equipment to ensure accurate and reliable data capture and analysis.- Broadcast and video production: The chip can be used in broadcast and video production equipment to enable high-speed data transfer between cameras, video servers, and editing systems.Overall, the DS280DF810ABWR integrated circuit chip offers high-speed data transmission, signal conditioning, and retiming capabilities, making it suitable for a wide range of applications that require reliable and high-performance data communication.
DS280DF810ABWR Relevant information