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DS280MB810ZBLR

DS280MB810ZBLR

Manufacturer No:

DS280MB810ZBLR

Manufacturer:

Texas Instruments

Description:

IC REPEATER 28GBPS 135NFBGA

Datasheet:

Datasheet

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DS280MB810ZBLR Specifications

  • Type
    Parameter
  • Supplier Device Package
    135-NFBGA (8x13)
  • Package / Case
    135-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    2.5V
  • Signal Conditioning
    Input Equalization
  • Delay Time
    -
  • Number of Channels
    8
  • Data Rate (Max)
    28Gbps
  • Output
    CML
  • Input
    CML
  • Applications
    -
  • Type
    Buffer, Multiplexer
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The DS280MB810ZBLR is a high-speed, low-power, and low-jitter integrated circuit chip designed for use in various applications. Some of the advantages and application scenarios of this chip are:1. High-speed data transmission: The DS280MB810ZBLR supports data rates up to 28.05 Gbps, making it suitable for high-speed data transmission applications such as data centers, telecommunications, and networking equipment.2. Low power consumption: This chip is designed to operate with low power consumption, making it ideal for applications where power efficiency is crucial, such as portable devices or battery-powered systems.3. Low jitter performance: The DS280MB810ZBLR offers low jitter performance, ensuring accurate and reliable data transmission. This makes it suitable for applications that require precise timing, such as high-speed data communication or video streaming.4. Signal conditioning and equalization: The chip provides signal conditioning and equalization features, allowing it to compensate for signal degradation over long transmission distances or in the presence of noise. This makes it suitable for applications that require long-range data transmission or in noisy environments.5. Backplane communication: The DS280MB810ZBLR is commonly used in backplane communication systems, where it enables high-speed data transmission between different modules or boards within a system. It helps to ensure reliable and efficient communication between various components.6. Optical module interfaces: The chip can be used in optical module interfaces, enabling high-speed data transmission between optical modules and other components in optical communication systems. It helps to bridge the gap between electrical and optical domains.Overall, the DS280MB810ZBLR integrated circuit chip offers high-speed, low-power, and low-jitter performance, making it suitable for a wide range of applications that require reliable and efficient data transmission.
DS280MB810ZBLR Relevant information