9DB102BGILFT

9DB102BGILFT

Manufacturer No:

9DB102BGILFT

Description:

IC CLK FANOUT/BUFF ZD 20TSSOP

Datasheet:

Datasheet

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9DB102BGILFT Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3.135V ~ 3.465V
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Output
    HCSL
  • PLL
    Yes
  • DigiKey Programmable
    Not Verified
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    -
The 9DB102BGILFT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data transmission and processing capabilities, making them suitable for applications that require fast and efficient data handling. 2. Low Power Consumption: The chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Small Form Factor: The chips are compact and come in a small form factor, making them suitable for space-constrained applications or devices where size and weight are important factors. 4. Versatility: These chips can be used in a wide range of applications, thanks to their versatile nature and compatibility with various systems and devices. 5. Reliability: The chips are designed to be highly reliable, ensuring stable and consistent performance over extended periods.Application Scenarios: 1. Communication Systems: The 9DB102BGILFT chips can be used in communication systems such as routers, switches, and network equipment to enable high-speed data transmission and processing. 2. Consumer Electronics: These chips can be integrated into consumer electronic devices like smartphones, tablets, and wearable devices to enhance their performance and enable faster data transfer. 3. Internet of Things (IoT): The chips can be used in IoT devices and sensors to enable efficient data processing and communication, facilitating seamless connectivity and data exchange. 4. Industrial Automation: These chips can be utilized in industrial automation systems, including robotics, control systems, and monitoring devices, to enable fast and reliable data processing and communication. 5. Automotive Electronics: The chips can be integrated into automotive electronics systems, such as infotainment systems, advanced driver-assistance systems (ADAS), and vehicle-to-vehicle communication, to enhance their performance and enable efficient data handling.Overall, the 9DB102BGILFT integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for various applications in communication systems, consumer electronics, IoT, industrial automation, and automotive electronics.