9DBL0252BKILF
Manufacturer No:
9DBL0252BKILF
Manufacturer:
Description:
CLOCK BUFFER 3.3V LP-HCSL PCIE
Datasheet:
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9DBL0252BKILF Specifications
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TypeParameter
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Supplier Device Package24-QFN (4x4)
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Package / Case24-VFQFN Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply3.135V ~ 3.465V
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Differential - Input:OutputYes/Yes
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Ratio - Input:Output1:2
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Number of Circuits1
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OutputHCSL
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PLLYes
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DigiKey ProgrammableNot Verified
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Product StatusObsolete
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PackagingTray
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Series-
The 9DBL0252BKILF is an integrated circuit chip designed for high-speed data transmission applications. Some of its advantages and application scenarios include:1. High-speed data transmission: The 9DBL0252BKILF chip supports data rates up to 25 Gbps, making it suitable for high-speed communication systems such as optical transceivers, data centers, and high-speed networking equipment.2. Low power consumption: The chip is designed with low power consumption in mind, making it suitable for applications where power efficiency is crucial, such as portable devices or battery-powered systems.3. Small form factor: The 9DBL0252BKILF chip is available in a small form factor package, allowing for compact designs and integration into space-constrained applications.4. Signal integrity and reliability: The chip incorporates advanced signal conditioning and equalization techniques to ensure high signal integrity and reliable data transmission over long distances or in noisy environments.5. Wide operating temperature range: The chip is designed to operate over a wide temperature range, making it suitable for applications that require reliable performance in harsh environments.6. Application scenarios: The 9DBL0252BKILF chip can be used in various scenarios, including high-speed optical communication systems, fiber-optic transceivers, high-speed networking equipment, data centers, and other applications that require high-speed data transmission with low power consumption.Overall, the 9DBL0252BKILF integrated circuit chip offers high-speed data transmission capabilities, low power consumption, small form factor, and reliable performance, making it suitable for a wide range of applications in the telecommunications and networking industries.
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