74LVC2G66DC,125

74LVC2G66DC,125

Manufacturer No:

74LVC2G66DC,125

Manufacturer:

NXP Semiconductors

Description:

NEXPERIA 74LVC2G66DC - SPST, 2 F

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC2G66DC,125 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    -
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    -
  • Multiplexer/Demultiplexer Circuit
    -
  • Switch Circuit
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74LVC
The EP900DM/B integrated circuit chips offer several advantages and can be applied to various scenarios:1. Low power consumption: EP900DM/B chips are designed with low power requirements, making them ideal for energy-efficient devices and battery-powered applications. This advantage makes them suitable for use in portable devices like smartphones, wearables, and IoT devices.2. High performance: Despite their low power consumption, EP900DM/B chips provide high performance capabilities. They offer fast processing speeds and efficient data management, making them suitable for tasks that require real-time processing or heavy computational needs.3. Connectivity options: These chips come with integrated wireless connectivity options such as Wi-Fi, Bluetooth, and NFC. This allows them to easily connect and communicate with other devices, enabling scenarios like IoT applications, smart home automation, and remote monitoring systems.4. Security features: EP900DM/B chips come with built-in security features like encryption and secure boot capabilities. This makes them suitable for applications that require data security, such as payment systems, biometric authentication, and secure communication channels.5. Cost-effective: The EP900DM/B chips offer a cost-effective solution due to their low power consumption and high integration capabilities. This makes them attractive for manufacturers looking to develop affordable devices without compromising on performance and functionality.6. Industrial applications: The EP900DM/B chips are suitable for various industrial applications, including robotics, automation systems, and industrial monitoring. With their high computing power and connectivity options, they can effectively handle complex tasks and provide real-time data analysis.In summary, the EP900DM/B integrated circuit chips offer advantages such as low power consumption, high performance, connectivity options, security features, cost-effectiveness, and suitability for industrial applications. Their broad range of capabilities makes them suitable for use in a variety of scenarios across multiple industries.