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HEF4052BTT,118

HEF4052BTT,118

Manufacturer No:

HEF4052BTT,118

Manufacturer:

NXP Semiconductors

Description:

NEXPERIA HEF4052BTT - DIFFERENTI

Datasheet:

Datasheet

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HEF4052BTT,118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    -
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    -
  • Multiplexer/Demultiplexer Circuit
    -
  • Switch Circuit
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The XCZU3CG-1UBVA530I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU3CG-1UBVA530I combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 cores provide powerful processing capabilities, enabling complex tasks such as real-time processing, image and video processing, and machine learning. 3. Programmable logic: The FPGA fabric in the chip allows for hardware acceleration, custom logic implementation, and real-time processing of data. It can be reprogrammed to adapt to changing requirements or to optimize performance. 4. Integrated peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and memory interfaces, reducing the need for additional external components and simplifying system design. 5. Low power consumption: The XCZU3CG-1UBVA530I is designed to be power-efficient, making it suitable for applications with strict power constraints.Application scenarios: 1. Embedded systems: The XCZU3CG-1UBVA530I is commonly used in embedded systems where both high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and FPGA fabric, the chip is suitable for edge computing applications where real-time processing and low latency are crucial. It can be used in edge AI, video analytics, and IoT gateways. 3. High-performance computing: The XCZU3CG-1UBVA530I can be used in applications that require high-performance computing, such as scientific research, data centers, and signal processing. 4. Software-defined networking: The chip's programmable logic can be utilized for implementing custom networking protocols, accelerating packet processing, and optimizing network performance. 5. Aerospace and defense: The XCZU3CG-1UBVA530I is suitable for aerospace and defense applications that require high reliability, real-time processing, and flexibility. It can be used in radar systems, avionics, and communication systems.These are just a few examples, and the XCZU3CG-1UBVA530I can be applied in various other domains depending on the specific requirements of the system.
HEF4052BTT,118 Relevant information