9DBL411BKILFT
Manufacturer No:
9DBL411BKILFT
Manufacturer:
Description:
IC FAN/BUFFER DIFF 20-VFQFPN
Datasheet:
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9DBL411BKILFT Specifications
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TypeParameter
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Package / Case20-VFQFN Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply3V ~ 3.6V
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Differential - Input:OutputYes/Yes
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Ratio - Input:Output1:4
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Number of Circuits1
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PLLNo
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DigiKey ProgrammableNot Verified
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Product StatusActive
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PackagingTape & Reel (TR)
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Series-
The 9DBL411BKILFT is an integrated circuit (IC) chip that is specifically designed for high-speed data transmission applications. Some of the advantages and application scenarios of this chip are as follows:1. High-speed data transmission: The 9DBL411BKILFT chip supports data rates up to 10 Gbps, making it suitable for high-speed communication systems such as Ethernet, fiber optic networks, and high-speed data links.2. Low power consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices and energy-efficient applications.3. Small form factor: The 9DBL411BKILFT chip is available in a small package, which makes it suitable for space-constrained applications such as portable devices, embedded systems, and compact communication equipment.4. Signal integrity and noise reduction: This chip incorporates advanced signal conditioning techniques to ensure high signal integrity and reduce noise interference, making it suitable for applications that require reliable and high-quality data transmission.5. Wide operating temperature range: The 9DBL411BKILFT chip is designed to operate over a wide temperature range, making it suitable for applications that require reliable performance in harsh environmental conditions.6. Application scenarios: Some of the application scenarios where the 9DBL411BKILFT chip can be used include high-speed data communication systems, data centers, telecommunications equipment, industrial automation, medical devices, and automotive electronics.Overall, the 9DBL411BKILFT chip offers high-speed data transmission capabilities, low power consumption, small form factor, signal integrity, and wide temperature range, making it suitable for a wide range of applications that require reliable and high-speed data communication.
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