ISL43141IBZ

ISL43141IBZ

Manufacturer No:

ISL43141IBZ

Manufacturer:

Intersil

Description:

SPST, 4 FUNC, 1 CHANNEL, CMOS, P

Datasheet:

Datasheet

Delivery:

Payment:

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ISL43141IBZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    7pF, 7pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    80ns, 30ns
  • Voltage - Supply, Dual (V±)
    ±2.6V ~ 6V
  • Voltage - Supply, Single (V+)
    2.7V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    65Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MPC850DSLCZQ50BU is a specific model of the MPC850 PowerQUICC microprocessor family developed by NXP Semiconductors. This integrated circuit chip offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the MPC850DSLCZQ50BU are:Advantages: 1. High Performance: The MPC850DSLCZQ50BU chip is designed to deliver high-performance computing capabilities, making it suitable for demanding applications. 2. Power Efficiency: It is built with power-efficient architecture, allowing it to optimize power consumption while maintaining performance. 3. Integrated Features: The chip integrates various features such as a PowerPC core, memory management unit, communication interfaces, timers, and interrupt controllers, reducing the need for additional external components. 4. Scalability: The MPC850DSLCZQ50BU chip offers scalability options, allowing it to be used in a wide range of applications with varying performance requirements. 5. Industrial-Grade Reliability: It is designed to meet industrial-grade reliability standards, making it suitable for applications that require robustness and durability.Application Scenarios: 1. Networking Equipment: The MPC850DSLCZQ50BU chip can be used in networking equipment such as routers, switches, and gateways. Its high-performance computing capabilities and integrated communication interfaces make it suitable for handling network traffic efficiently. 2. Industrial Automation: With its power efficiency and industrial-grade reliability, the chip can be applied in industrial automation systems. It can control and monitor various processes, communicate with other devices, and handle real-time data processing. 3. Embedded Systems: The MPC850DSLCZQ50BU chip can be used in embedded systems that require high-performance computing, such as automotive electronics, medical devices, and aerospace applications. Its integrated features and scalability options make it suitable for various embedded applications. 4. Communication Systems: The chip's integrated communication interfaces, including Ethernet, serial ports, and Universal Serial Bus (USB), make it suitable for communication systems such as modems, gateways, and telecommunication equipment. 5. Control Systems: The MPC850DSLCZQ50BU chip can be utilized in control systems for monitoring and controlling various processes. Its high-performance computing capabilities and integrated features enable precise control and real-time data processing.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the system using the MPC850DSLCZQ50BU chip.