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9DB833AGLF

9DB833AGLF

Manufacturer No:

9DB833AGLF

Description:

IC CLK FANOUT/BUFF ZD 48TSSOP

Datasheet:

Datasheet

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9DB833AGLF Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3.135V ~ 3.465V
  • Differential - Input:Output
    Yes/Yes
  • Number of Circuits
    1
  • Output
    HCSL
  • PLL
    Yes
  • DigiKey Programmable
    Not Verified
  • Product Status
    Active
  • Packaging
    Tube
  • Series
    -
The 9DB833AGLF integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data transmission and processing capabilities, making them suitable for applications that require fast and efficient data handling. 2. Low Power Consumption: The chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Compact Size: The chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Versatility: These chips can be used in a wide range of applications, thanks to their flexible design and compatibility with different communication protocols. 5. Reliability: The chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and long-term performance.Application Scenarios: 1. Networking Equipment: The 9DB833AGLF chips can be used in routers, switches, and other networking equipment to enable high-speed data transmission and efficient network management. 2. Telecommunications: These chips are suitable for telecommunications applications, such as modems, wireless access points, and base stations, where fast and reliable data communication is essential. 3. Industrial Automation: The chips can be utilized in industrial automation systems for real-time data processing, control, and monitoring of various processes. 4. Internet of Things (IoT): With their low power consumption and compact size, these chips are well-suited for IoT devices, enabling seamless connectivity and efficient data exchange. 5. Consumer Electronics: The chips can be integrated into consumer electronics like smart TVs, set-top boxes, and gaming consoles to enhance their connectivity and processing capabilities.Overall, the 9DB833AGLF integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in networking, telecommunications, industrial automation, IoT, and consumer electronics.
9DB833AGLF Relevant information