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MAX4051ACPE

MAX4051ACPE

Manufacturer No:

MAX4051ACPE

Description:

IC MUX 8:1 100OHM 16DIP

Datasheet:

Datasheet

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MAX4051ACPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    2pF, 2pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±2.7V ~ 8V
  • Voltage - Supply, Single (V+)
    2V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU3CG-L1UBVA530I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios:Advantages: 1. High-performance processing: The XCZU3CG-L1UBVA530I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be customized and reconfigured to implement specific functions or algorithms. This flexibility is advantageous for applications that require hardware acceleration or specialized processing.3. Integrated system-on-chip (SoC): The XCZU3CG-L1UBVA530I chip integrates multiple components into a single device, including processors, programmable logic, memory interfaces, and various peripherals. This integration simplifies system design, reduces board space, and lowers power consumption.4. Versatility: The chip supports a wide range of interfaces and connectivity options, including PCIe, USB, Ethernet, HDMI, and more. This versatility enables it to be used in various applications that require connectivity and communication capabilities.Application scenarios: 1. Embedded systems: The XCZU3CG-L1UBVA530I chip is well-suited for embedded systems that require high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, automotive systems, and aerospace.2. Edge computing: With its powerful processing capabilities and integrated features, the chip is suitable for edge computing applications. It can perform real-time processing and analysis of data at the edge of the network, enabling faster response times and reduced latency.3. Video processing and analytics: The XCZU3CG-L1UBVA530I chip's programmable logic and high-performance processing make it ideal for video processing and analytics applications. It can handle tasks such as video encoding/decoding, image recognition, object detection, and video analytics.4. High-speed networking: The chip's support for various connectivity options, including high-speed Ethernet and PCIe, makes it suitable for networking applications. It can be used in routers, switches, network appliances, and other networking equipment.5. Software-defined radio (SDR): The XCZU3CG-L1UBVA530I chip's programmable logic resources can be utilized for implementing SDR functionality. It can be used in applications such as wireless communication systems, cognitive radios, and radio frequency (RF) signal processing.Overall, the XCZU3CG-L1UBVA530I chip offers a combination of processing power, programmability, and integration, making it suitable for a wide range of applications that require high-performance processing, connectivity, and customization capabilities.
MAX4051ACPE Relevant information