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MAX399ESE

MAX399ESE

Manufacturer No:

MAX399ESE

Description:

IC SWITCH SP4T X 2 100OHM 16SOIC

Datasheet:

Datasheet

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MAX399ESE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 20pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 15V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S050-1FCSG325 is an integrated circuit chip from Microsemi, which is a low-power, high-performance FPGA (Field-Programmable Gate Array). Here are some advantages and application scenarios of this chip:Advantages: 1. Low Power Consumption: The M2S050-1FCSG325 chip is designed to consume minimal power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. High Performance: It offers high-speed processing capabilities, enabling it to handle complex tasks and data-intensive applications efficiently. 3. Flexibility: Being an FPGA, the chip allows for reprogramming and customization of its logic functions, making it adaptable to various applications and evolving requirements. 4. Integration: The chip integrates multiple components, including programmable logic, memory, and I/O interfaces, reducing the need for additional external components and simplifying the overall system design. 5. Reliability: Microsemi is known for its reliable and robust FPGA solutions, ensuring the M2S050-1FCSG325 chip's stability and durability.Application Scenarios: 1. Industrial Automation: The M2S050-1FCSG325 chip can be used in industrial automation systems for tasks like process control, machine vision, and data acquisition, thanks to its high performance and flexibility. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip is suitable for IoT devices, such as smart sensors, wearable devices, and edge computing applications. 3. Communications: The chip can be utilized in networking equipment, routers, and switches to handle high-speed data processing, packet routing, and protocol handling. 4. Medical Devices: Its low power consumption and reliability make it suitable for medical devices like patient monitoring systems, portable diagnostic equipment, and medical imaging devices. 5. Aerospace and Defense: The M2S050-1FCSG325 chip can be used in aerospace and defense applications, such as avionics systems, radar signal processing, and secure communication systems, where high performance, reliability, and customization are critical.These are just a few examples, and the versatility of the M2S050-1FCSG325 chip allows it to be applied in various other domains where programmable logic and high-performance processing are required.
MAX399ESE Relevant information