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MAX399CPE

MAX399CPE

Manufacturer No:

MAX399CPE

Description:

IC SWITCH SP4T X 2 100OHM 16DIP

Datasheet:

Datasheet

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MAX399CPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 20pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 15V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S150T-1FCG1152I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150T-1FCG1152I IC chip:Advantages: 1. Versatility: The M2S150T-1FCG1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core, providing the flexibility of programmable logic and the processing power of an embedded microcontroller. 2. Integration: It integrates various components like FPGA fabric, processor, memory, and peripherals into a single chip, reducing the need for external components and simplifying system design. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage, making it suitable for applications requiring high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The combination of FPGA fabric and ARM Cortex-M3 processor allows for high-performance computing and real-time processing capabilities.Application scenarios: 1. Industrial automation: The M2S150T-1FCG1152I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features of the SmartFusion2 family make it suitable for aerospace and defense applications, such as secure communication systems, avionics, and military-grade embedded systems. 4. Medical devices: The chip can be used in medical devices for signal processing, data acquisition, and control functions, where both programmable logic and processing power are required. 5. Automotive: The M2S150T-1FCG1152I chip can be utilized in automotive applications like advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs).It's important to note that the specific advantages and application scenarios may vary depending on the requirements and capabilities of the M2S150T-1FCG1152I chip. It is recommended to refer to the manufacturer's documentation and consult with experts for detailed information and suitability for specific use cases.
MAX399CPE Relevant information