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MAX4501EXK-T

MAX4501EXK-T

Manufacturer No:

MAX4501EXK-T

Description:

IC SW SPST-NOX1 250OHM SC70-5

Datasheet:

Datasheet

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MAX4501EXK-T Specifications

  • Type
    Parameter
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    3pF, 3pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    75ns, 50ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    250Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The M2S090T-1FCSG325 is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090T-1FCSG325 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, processor, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S090T-1FCSG325, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S090T-1FCSG325 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and processor, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The chip's integration, low power consumption, and security features make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's versatility and low power consumption make it suitable for medical devices such as patient monitoring systems, portable diagnostic equipment, and implantable devices. 5. Communications: The chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption/decryption. Its FPGA fabric allows for customization and adaptation to different communication standards.These are just a few examples of the advantages and application scenarios of the M2S090T-1FCSG325 chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.
MAX4501EXK-T Relevant information