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MAX393ESE

MAX393ESE

Manufacturer No:

MAX393ESE

Description:

IC SW SPST-NO/NCX4 35OHM 16SOIC

Datasheet:

Datasheet

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MAX393ESE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    130ns, 75ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 15V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU2EG-1SFVA625I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. Versatility: The XCZU2EG-1SFVA625I is a highly versatile chip that combines a processing system (PS) with programmable logic (PL) in a single device. This integration allows for flexible and efficient implementation of various applications. 2. High-performance processing: The chip features a dual-core Arm Cortex-A53 processor, which provides powerful processing capabilities for running complex software applications. 3. Programmable logic: The PL section of the chip consists of programmable logic cells, which can be customized to implement specific functions or algorithms. This flexibility makes it suitable for a wide range of applications. 4. FPGA fabric: The chip includes a field-programmable gate array (FPGA) fabric, which enables hardware acceleration and customization. This allows for the implementation of specialized hardware functions, improving performance and efficiency. 5. High-speed interfaces: The XCZU2EG-1SFVA625I supports various high-speed interfaces, such as PCIe, Gigabit Ethernet, USB, and DDR4 memory interfaces. These interfaces enable connectivity with external devices and systems.Application scenarios: 1. Embedded systems: The XCZU2EG-1SFVA625I is commonly used in embedded systems where both processing power and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Software-defined networking (SDN): The chip's high-performance processing capabilities make it suitable for SDN applications, where it can handle complex networking tasks and protocol processing. 3. High-performance computing (HPC): The FPGA fabric and high-speed interfaces of the chip make it suitable for HPC applications. It can be used for tasks like data acceleration, algorithm acceleration, and parallel processing. 4. Video and image processing: The XCZU2EG-1SFVA625I can be utilized in applications that require real-time video and image processing, such as video surveillance, medical imaging, and multimedia systems. 5. Wireless communication: The chip's high-speed interfaces and programmable logic make it suitable for wireless communication applications, including baseband processing, software-defined radio (SDR), and wireless protocol implementation.These are just a few examples of the advantages and application scenarios of the XCZU2EG-1SFVA625I chip. The specific usage depends on the requirements and needs of the target application.
MAX393ESE Relevant information